是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 88 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.33 |
其他特性: | SRAM ORGANISATION IS 4M X 16 | JESD-30 代码: | R-PBGA-B88 |
JESD-609代码: | e1 | 长度: | 11.6 mm |
内存密度: | 134217728 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 88 |
字数: | 8388608 words | 字数代码: | 8000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 8MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 3.3 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 8 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
AM50DL128CG70IS | AMD |
获取价格 |
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 | |
AM50DL128CG70IS | SPANSION |
获取价格 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM | |
AM50DL128CG70IT | AMD |
获取价格 |
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 | |
AM50DL128CG70IT | SPANSION |
获取价格 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM | |
AM50DL128CG85FS | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA88, 11.60 X 8 MM, FBGA-88 | |
AM50DL128CG85FT | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA88, 11.60 X 8 MM, FBGA-88 | |
AM50DL128CG85IS | SPANSION |
获取价格 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM | |
AM50DL128CG85IS | AMD |
获取价格 |
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 | |
AM50DL128CG85IT | AMD |
获取价格 |
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64 | |
AM50DL128CG85IT | SPANSION |
获取价格 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |