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AM29LV065MU102FF PDF预览

AM29LV065MU102FF

更新时间: 2024-11-10 19:58:39
品牌 Logo 应用领域
飞索 - SPANSION 光电二极管内存集成电路
页数 文件大小 规格书
8页 104K
描述
Flash, 8MX8, 100ns, PDSO48, REVERSE, TSOP-48

AM29LV065MU102FF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP包装说明:REVERSE, TSOP-48
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.4最长访问时间:100 ns
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:18.4 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:48字数:8388608 words
字数代码:8000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:8MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1-R封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:12 mmBase Number Matches:1

AM29LV065MU102FF 数据手册

 浏览型号AM29LV065MU102FF的Datasheet PDF文件第2页浏览型号AM29LV065MU102FF的Datasheet PDF文件第3页浏览型号AM29LV065MU102FF的Datasheet PDF文件第4页浏览型号AM29LV065MU102FF的Datasheet PDF文件第5页浏览型号AM29LV065MU102FF的Datasheet PDF文件第6页浏览型号AM29LV065MU102FF的Datasheet PDF文件第7页 
ADVANCE INFORMATION  
Am29LV065M  
64 Megabit (8 M x 8-Bit) MirrorBit 3.0 Volt-only  
Uniform Sector Flash Memory with VersatileI/O Control  
DISTINCTIVE CHARACTERISTICS  
ARCHITECTURAL ADVANTAGES  
— 8-byte read page buffer  
— 32-byte write buffer  
Single power supply operation  
Low power consumption (typical values at 3.0 V,  
— 2.7–3.6 volt read, erase, and program operations  
5 MHz)  
Enhanced VersatileI/O control  
— 30 mA typical active read current  
— 50 mA typical erase/program current  
— 1 µA typical standby mode current  
— Device generates data output voltages and tolerates  
data input voltages as determined by the voltage on  
the VIO pin; operates from 1.65 to 3.6 V  
Package options  
— 48-pin TSOP  
Manufactured on 0.23 µm MirrorBit process  
technology  
— 63-ball FBGA  
SecSi (Secured Silicon) Sector region  
— 256-byte sector for permanent, secure identification  
through an 16-byte random Electronic Serial Number,  
accessible through a command sequence  
SOFTWARE & HARDWARE FEATURES  
Software features  
— Program Suspend & Resume: read other sectors  
before programming operation is completed  
— May be programmed and locked at the factory or by  
the customer  
— Erase Suspend & Resume: read/program other  
sectors before an erase operation is completed  
Flexible sector architecture  
— One hundred twenty-eight 64 Kbyte sectors  
— Data# polling & toggle bits provide status  
Compatibility with JEDEC standards  
— Unlock Bypass Program command reduces overall  
multiple-byte programming time  
— Provides pinout and software compatibility for  
single-power supply flash, and superior inadvertent  
write protection  
— CFI (Common Flash Interface) compliant: allows host  
system to identify and accommodate multiple flash  
devices  
Minimum 100,000 erase cycle guarantee per sector  
20-year data retention at 125°C  
Hardware features  
— Sector Group Protection: hardware method of  
preventing write operations within a sector group  
PERFORMANCE CHARACTERISTICS  
High performance  
Temporary Sector Unprotect: VID-level method of  
changing code in locked sectors  
— 90 ns access time  
— ACC (high voltage) pin accelerates programming  
time for higher throughput during system production  
— 25 ns page read times  
— 1 s typical sector erase time  
— Hardware reset pin (RESET#) resets device  
— 3.0 µs typical write buffer byte programming time:  
32-byte write buffer reduces overall programming  
time for multiple-byte updates  
— Ready/Busy# pin (RY/BY#) detects program or erase  
cycle completion  
Publication# 25262  
Issue Date: August 3, 2001  
Rev: A Amendment/0  
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data  
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.  
Refer to AMD’s Website (www.amd.com) for the latest information.  

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