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ADP46075W3 PDF预览

ADP46075W3

更新时间: 2024-11-24 14:58:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
15页 1366K
描述
Automotive-grade ACEPACK DRIVE power module, sixpack topology 750 V, 1.6 mOhm typ. SiC MOSFET gen.3 based

ADP46075W3 数据手册

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ADP46075W3  
Datasheet  
Automotive-grade ACEPACK DRIVE power module, sixpack topology  
750 V, 1.6 mΩ typ. SiC MOSFET gen.3 based  
Features  
AQG 324 qualified  
750 V blocking voltage  
1.6 mΩ of typical RDS(on)  
Maximum operating junction temperature TJ = 175 °C  
Very low switching energy  
Low inductive compact design for an higher power density  
Si3N4 AMB substrate to improve thermal performance  
SiC Power MOSFET chip sintered to substrate for improved lifetime  
4.2 kV DC 1 s insulation  
ACEPACK DRIVE  
Directly liquid cooled base plate with pin-fins  
Three integrated NTC temperature sensors  
Application  
Main inverter (electric traction)  
Description  
The ACEPACK DRIVE is a compact sixpack module optimized for hybrid and electric  
vehicles traction inverter. This power module features switches based on silicon  
carbide Power MOSFET 3rd generation, are characterized by very low RDS(on), very  
limited switching losses and outstanding performances in synchronous rectification  
working mode. This will ensure superb efficiency in final application, saving battery  
recharging cycles.  
A copper base plate with pin-fin base structure make direct fluid cooling available for  
this power module minimizing thermal resistance.  
Product status link  
A dedicated pin-out has been developed to get the best switching performances and  
press-fit pins will ensure optimal connection with driving board.  
ADP46075W3  
Product summary  
Order code  
ADP46075W3  
ADP46075W3  
ACEPACK DRIVE  
Press fit  
Marking  
Package  
Leads type  
Packing  
Tray  
DS13814 - Rev 3 - February 2023  
For further information contact your local STMicroelectronics sales office.  
www.st.com  

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