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ADCLK946/PCBZ PDF预览

ADCLK946/PCBZ

更新时间: 2024-01-08 19:19:57
品牌 Logo 应用领域
亚德诺 - ADI 时钟
页数 文件大小 规格书
12页 354K
描述
Six LVPECL Outputs, SiGe Clock Fanout Buffer

ADCLK946/PCBZ 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC24,.16SQ,20针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.83
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/579004.3.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=579004
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=5790043D View:https://componentsearchengine.com/viewer/3D.php?partID=579004
Samacsys PartID:579004Samacsys Image:https://componentsearchengine.com/Images/9/ADCLK946BCPZ.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/3/ADCLK946BCPZ.jpgSamacsys Pin Count:25
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Quad Flat No-Lead
Samacsys Footprint Name:CP-24-2-+-+Samacsys Released Date:2017-01-11 11:21:59
Is Samacsys:N系列:946
输入调节:DIFFERENTIALJESD-30 代码:S-XQCC-N24
JESD-609代码:e3长度:4 mm
逻辑集成电路类型:LOW SKEW CLOCK DRIVER湿度敏感等级:3
功能数量:1反相输出次数:
端子数量:24实输出次数:6
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC24,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:0.22 ns
传播延迟(tpd):0.22 ns认证状态:Not Qualified
Same Edge Skew-Max(tskwd):0.28 ns座面最大高度:1 mm
子类别:Clock Drivers最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):2.97 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:4 mmBase Number Matches:1

ADCLK946/PCBZ 数据手册

 浏览型号ADCLK946/PCBZ的Datasheet PDF文件第6页浏览型号ADCLK946/PCBZ的Datasheet PDF文件第7页浏览型号ADCLK946/PCBZ的Datasheet PDF文件第8页浏览型号ADCLK946/PCBZ的Datasheet PDF文件第9页浏览型号ADCLK946/PCBZ的Datasheet PDF文件第11页浏览型号ADCLK946/PCBZ的Datasheet PDF文件第12页 
ADCLK946  
ensure that the pins are within the rated input differential and  
common-mode ranges.  
PCB LAYOUT CONSIDERATIONS  
The ADCLK946 buffer is designed for very high speed  
applications. Consequently, high speed design techniques must  
be used to achieve the specified performance. It is critically  
important to use low impedance supply planes for both the  
negative supply (VEE) and the positive supply (VCC) planes as  
part of a multilayer board. Providing the lowest inductance  
return path for switching currents ensures the best possible  
performance in the target application.  
If the return is floated, the device exhibits a 100 ꢁ cross-  
termination, but the source must then control the common-  
mode voltage and supply the input bias currents.  
There are ESD/clamp diodes between the input pins to prevent  
the application from developing excessive offsets to the input  
transistors. ESD diodes are not optimized for best ac perfor-  
mance. When a clamp is required, it is recommended that  
appropriate external diodes be used.  
The following references to the ground plane assume that  
the VEE power plane is grounded for LVPECL operation.  
Note that, for ECL operation, the VCC power plane becomes  
the ground plane.  
Exposed Metal Paddle  
The exposed metal paddle on the ADCLK946 package is both  
an electrical connection and a thermal enhancement. For the  
device to function properly, the paddle must be properly  
attached to the VEE pin.  
It is also important to adequately bypass the input and output  
supplies. Place a 1 μF electrolytic bypass capacitor within several  
inches of each VCC power supply pin to the ground plane. In  
addition, place multiple high quality 0.001 μF bypass capacitors  
as close as possible to each of the VCC supply pins, and connect  
the capacitors to the ground plane with redundant vias.  
Carefully select high frequency bypass capacitors for minimum  
inductance and ESR. To improve the effectiveness of the bypass  
at high frequencies, minimize parasitic layout inductance. Also,  
avoid discontinuities along input and output transmission lines  
that can affect jitter performance.  
When properly mounted, the ADCLK946 also dissipates heat  
through its exposed paddle. The PCB acts as a heat sink for the  
ADCLK946. The PCB attachment must provide a good thermal  
path to a larger heat dissipation area. This requires a grid of vias  
from the top layer down to the VEE power plane (see Figure 18).  
The ADCLK946 evaluation board (ADCLK946/PCBZ)  
provides an example of how to attach the part to the PCB.  
In a 50 Ω environment, input and output matching have a  
significant impact on performance. The buffer provides internal  
CLK  
50 Ω termination resistors for both CLK and  
inputs.  
VIAS TO V POWER  
EE  
Normally, the return side is connected to the reference pin that is  
provided. Carefully bypass the termination potential using  
ceramic capacitors to prevent undesired aberrations on the  
input signal due to parasitic inductance in the termination  
return path. If the inputs are dc-coupled to a source, take care to  
PLANE  
Figure 18. PCB Land for Attaching Exposed Paddle  
Rev. 0 | Page 10 of 12  
 
 

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