Data Sheet
ADCLK905/ADCLK907/ADCLK925
D1
1
2
3
4
12
11
10
9
Q1
Q1
Q2
Q2
D1
D2
D2
ADCLK907
TOP VIEW
(Not to Scale)
NOTES
1. EXPOSED PAD. THE EXPOSED PAD IS NOT ELECTRICALLY CONNECTED TO ANY PART OF THE CIRCUIT.
IT CAN BE LEFT FLOATING FOR OPTIMAL ELECTRICAL ISOLATION BETWEEN THE PACKAGE HANDLE
AND THE SUBSTRATE OF THE DIE. IT CAN ALSO BE SOLDERED TO THE APPLICATION BOARD IF IMPROVED
THERMAL AND/OR MECHANICAL STABILITY IS DESIRED. EXPOSED METAL AT THE CORNERS OF THE PACKAGE
IS CONNECTED TO THIS EXPOSED PAD. ALLOW SUFFICIENT CLEARANCE TO VIAS AND OTHER COMPONENTS.
Figure 5. ADCLK907 Pin Configuration
Table 5. Pin Function Descriptions for Dual 1:1 ADCLK907 Buffer
Pin No.
Mnemonic
Description
1
D1
D1
D2
D2
VT2
Noninverting Input 1.
2
Inverting Input 1.
3
Noninverting Input 2.
4
Inverting Input 2.
5
Center Tap 2. Center tap of 100 Ω input resistor, Channel 2.
Reference Voltage 2. Reference voltage for biasing ac-coupled inputs, Channel 2.
Negative Supply Voltage.
6
VREF
VEE
2
7, 14
8, 13
9
VCC
Q2
Q2
Q1
Q1
VREF
VT1
Positive Supply Voltage. Pin 8 and Pin 13 are not strapped internally.
Inverting Output 2.
10
11
12
15
16
Noninverting Output 2.
Inverting Output 1.
Noninverting Output 1.
1
Reference Voltage 1. Reference voltage for biasing ac-coupled inputs, Channel 1.
Center Tap 1. Center tap of 100 Ω input resistor, Channel 1.
EPAD
Exposed Pad. The exposed pad is not electrically connected to any part of the circuit. It can be left floating for
optimal electrical isolation between the package handle and the substrate of the die. It can also be soldered to
the application board if improved thermal and/or mechanical stability is desired. Exposed metal at the corners
of the package is connected to this exposed pad. Allow sufficient clearance to vias and other components.
Rev. B | Page 7 of 16