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97-AQ132D-P

更新时间: 2024-09-14 06:34:11
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描述
132-Pin Amp Footprint PQFP-to-PGA Socket

97-AQ132D-P 数据手册

  
P/N 97-AQ132D 132-Pin Amp Footprint  
PQFP-to-PGA Socket  
FEATURES  
• Convert surface-mount PQFP packages to an Amp interstitial PGA footprint.  
• Reduce costs by using less-expensive PQFP packages to replace PGA footprints in  
existing designs.  
• Pins are mechanically fastened and soldered to board using Aries patented process,  
creating a reliable electrical connection and rugged contact.  
Consult factory for Panelized Form or for mounting of consigned chips.  
GENERAL SPECIFICATIONS  
• BODY MATERIAL: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces  
• PADS: bare Cu protected with ENIG (Immersion Au over Electroless Ni) to  
eliminate coplanarity concerns and solder bridges associated with hot air solder  
leveling  
CUSTOMIZATION: In addition to the standard products shown  
on this page, Aries specializes in custom design and production.  
Special materials, platings, sizes, and configurations can be  
furnished, depending on the quantity. NOTE: Aries reserves the  
right to change product general specifications without notice.  
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M  
• PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE  
AMS-QQ-N-290  
• OPERATING TEMPERATURE: 221°F [105°C]  
ORDERING INFORMATION  
Specify...  
P/N 97-AQ132D or  
MOUNTING CONSIDERATIONS  
• SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia.  
• Will plug into existing PGA footprint with matching Pad assignments  
P/N 97-AQ132D-P for Panelized form  
ALL DIMENSIONS: INCHES [MILLIMETERS]  
ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED  
ROW-TO-ROW AND PIN-TO-PIN 0.003 [ 0.08] NON-CUMULATIVE  
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS  
Bristol, PA 19007-6810 USA  
TEL (215) 781-9956 • FAX (215) 781-9845  
WWW.ARIESELEC.COMINFO@ARIESELEC.COM  
18022  
Rev. AA  
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED  

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