Document Number: IMX6DQPAEC
Rev. 3, 11/2018
NXP Semiconductors
Data Sheet: Technical Data
MCIMX6QPxAxxxxA
MCIMX6QPxAxxxxB
MCIMX6DPxAxxxxA
MCIMX6DPxAxxxxB
i.MX6DualPlus/6QuadPlus
Automotive Applications
Processors
Package Information
FCPBGA Package
21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1 Introduction
The i.MX 6DualPlus/6QuadPlus processors offer the
highest levels of graphics processing performance in the
i.MX 6 series family and are ideally suited for graphics
intensive applications such as reconfigurable instrument
clusters and high performance infotainment systems.
2
3
4
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20
4.2 Power Supplies Requirements and Restrictions . . 33
4.3 Integrated LDO Voltage Regulator Parameters . . 34
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53
4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64
4.11 General-Purpose Media Interface (GPMI) Timing. 64
4.12 External Peripheral Interface Parameters . . . . . . . 73
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139
Package Information and Contact Assignments. . . . . . 141
6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141
6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
The i.MX 6DualPlus/6QuadPlus processors feature
advanced implementation of the quad
®
®
Arm Cortex -A9 core, which operates at speeds up to
1 GHz. They include updated versions of the 2D and 3D
graphics processors, 1080p video processing, and
integrated power management. Each processor provides
a 64-bit DDR3/DDR3L/LPDDR2 memory interface and
a number of other interfaces for connecting peripherals,
®
such as WLAN, Bluetooth , GPS, hard drive, displays,
5
6
7
and camera sensors.
The i.MX 6DualPlus/6QuadPlus processors are
specifically useful for applications such as the
following:
•
Reconfigurable instrument cluster high
performance infotainment
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
5秒后页面跳转
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
