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935321526557

更新时间: 2024-09-20 19:10:59
品牌 Logo 应用领域
恩智浦 - NXP 时钟微控制器外围集成电路
页数 文件大小 规格书
114页 909K
描述
Microcontroller

935321526557 技术参数

生命周期:Active包装说明:LQFP,
Reach Compliance Code:unknown风险等级:5.66
具有ADC:YES地址总线宽度:
位大小:32最大时钟频率:16 MHz
DMA 通道:YES外部数据总线宽度:
长度:24 mmI/O 线路数量:149
端子数量:176PWM 通道:YES
封装代码:LQFP封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH速度:64 MHz
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD宽度:24 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER RISCBase Number Matches:1

935321526557 数据手册

 浏览型号935321526557的Datasheet PDF文件第2页浏览型号935321526557的Datasheet PDF文件第3页浏览型号935321526557的Datasheet PDF文件第4页浏览型号935321526557的Datasheet PDF文件第5页浏览型号935321526557的Datasheet PDF文件第6页浏览型号935321526557的Datasheet PDF文件第7页 
NXP Semiconductors  
Data Sheet: Technical Data  
Document Number: MPC5607B  
Rev. 9, 11/2017  
MPC5607B  
MPC5607B Microcontroller  
Data Sheet  
144 LQFP (20 mm x 20 mm)  
208 MAPBGA (17 mm x 17 mm)  
100 LQFP (14 mm x 14mm)  
LQFP176 (24 mm x 24 mm)  
Features  
Up to 10 serial communication interface (LINFlex)  
modules  
Up to 6 enhanced full CAN (FlexCAN) modules with  
configurable buffers  
Single issue, 32-bit CPU core complex (e200z0h)  
Compliant with the Power Architecture® technology  
embedded category  
1 inter-integrated circuit (I2C) interface module  
Up to 149 configurable general purpose pins supporting  
input and output operations (package dependent)  
Real-Time Counter (RTC)  
Clock source from internal 128 kHz or 16 MHz oscillator  
supporting autonomous wakeup with 1 ms resolution with  
maximum timeout of 2 seconds  
Optional support for RTC with clock source from external  
32 kHz crystal oscillator, supporting wakeup with 1 sec  
resolution and maximum timeout of 1 hour  
Up to 8 periodic interrupt timers (PIT) with 32-bit counter  
resolution  
Nexus development interface (NDI) per IEEE-ISTO  
5001-2003 Class Two Plus  
Device/board boundary scan testing supported per Joint  
Test Action Group (JTAG) of IEEE (IEEE 1149.1)  
On-chip voltage regulator (VREG) for regulation of  
input supply for all internal levels  
Enhanced instruction set allowing variable length  
encoding (VLE) for code size footprint reduction.  
With the optional encoding of mixed 16-bit and  
32-bit instructions, it is possible to achieve  
significant code size footprint reduction.  
Up to 1.5 MB on-chip code flash memory supported with  
the flash memory controller  
64 (4 × 16) KB on-chip data flash memory with ECC  
Up to 96 KB on-chip SRAM  
Memory protection unit (MPU) with 8 region descriptors  
and 32-byte region granularity on certain family members  
(Refer to Table 1 for details.)  
Interrupt controller (INTC) capable of handling 204  
selectable-priority interrupt sources  
Frequency modulated phase-locked loop (FMPLL)  
Crossbar switch architecture for concurrent access to  
peripherals, Flash, or RAM from multiple bus masters  
16-channel eDMA controller with multiple transfer  
request sources using DMA multiplexer  
Boot assist module (BAM) supports internal Flash  
programming via a serial link (CAN or SCI)  
Timer supports I/O channels providing a range of 16-bit  
input capture, output compare, and pulse width  
modulation functions (eMIOS)  
2 analog-to-digital converters (ADC): one 10-bit and one  
12-bit  
Cross Trigger Unit to enable synchronization of ADC  
conversions with a timer event from the eMIOS or PIT  
Up to 6 serial peripheral interface (DSPI) modules  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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