853S024AYLFT

更新时间： 2024-01-21 23:46:37

品牌	Logo	应用领域
艾迪悌 - IDT		时钟驱动器逻辑集成电路
页数	文件大小	规格书
16页	720K
描述
LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-3.3V, 2.5V LVPECL FANOUT BUFFER

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中文翻译

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技术参数
数据手册
替代型号

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853S024AYLFT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	TQFP
包装说明：	10 X 10 MM, 1 MM HEIGHT, ROHS COMPLIANT, MS-026ACD, TQFP-64	针数：	64
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.8
Is Samacsys：	N	其他特性：	ALSO OPERATES ON 2.5V SUPPLY
系列：	853S	输入调节：	DIFFERENTIAL
JESD-30 代码：	S-PQFP-G64	JESD-609代码：	e3
长度：	10 mm	逻辑集成电路类型：	LOW SKEW CLOCK DRIVER
湿度敏感等级：	3	功能数量：	1
反相输出次数：		端子数量：	64
实输出次数：	24	最高工作温度：	70 °C
最低工作温度：		输出特性：	OPEN-EMITTER
封装主体材料：	PLASTIC/EPOXY	封装代码：	HTFQFP
封装等效代码：	TQFP64,.47SQ	封装形状：	SQUARE
封装形式：	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	260
电源：	2.5/3.3 V	Prop。Delay @ Nom-Sup：	0.8 ns
传播延迟（tpd）：	0.8 ns	认证状态：	Not Qualified
Same Edge Skew-Max（tskwd）：	0.125 ns	座面最大高度：	1.2 mm
子类别：	Clock Drivers	最大供电电压 (Vsup)：	2.625 V
最小供电电压 (Vsup)：	2.375 V	标称供电电压 (Vsup)：	2.5 V
表面贴装：	YES	温度等级：	COMMERCIAL
端子面层：	Matte Tin (Sn)	端子形式：	GULL WING
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	10 mm
最小 fmax：	2000 MHz	Base Number Matches：	1

853S024AYLFT 数据手册

ICS853S024

LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-3.3V, 2.5V LVPECL FANOUT BUFFER

PRELIMINARY

EPAD Thermal Release Path

In order to maximize both the removal of heat from the package

and the electrical performance, a land pattern must be

application specific and dependent upon the package power

dissipation as well as electrical conductivity requirements. Thus,

thermal and electrical analysis and/or testing are recommended to

determine the minimum number needed. Maximum thermal and

electrical performance is achieved when an array of vias is

incorporated in the land pattern. It is recommended to use as many

vias connected to ground as possible. It is also recommended that

the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz

copper via barrel plating. This is desirable to avoid any solder

wicking inside the via during the soldering process which may

result in voids in solder between the exposed pad/slug and the

thermal land. Precautions should be taken to eliminate any solder

voids between the exposed heat slug and the land pattern. Note:

These recommendations are to be used as a guideline only. For

further information, refer to the Application Note on the Surface

Mount Assembly of Amkor’s Thermally/Electrically Enhance

Leadfame Base Package, Amkor Technology.

incorporated on the Printed Circuit Board (PCB) within the footprint

of the package corresponding to the exposed metal pad or

exposed heat slug on the package, as shown in Figure 5. The

solderable area on the PCB, as defined by the solder mask, should

be at least the same size/shape as the exposed pad/slug area on

the package to maximize the thermal/electrical performance.

Sufficient clearance should be designed on the PCB between the

outer edges of the land pattern and the inner edges of pad pattern

for the leads to avoid any shorts.

While the land pattern on the PCB provides a means of heat

transfer and electrical grounding from the package to the board

through a solder joint, thermal vias are necessary to effectively

conduct from the surface of the PCB to the ground plane(s). The

land pattern must be connected to ground through these vias. The

vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are

SOLDER

EXPOSED HEAT SLUG

LAND PATTERN

(GROUND PAD)

PIN PAD

GROUND PLANE

PIN PAD

THERMAL VIA

Figure 5. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)

LOW SKEW LVPECL FANOUT BUFFER

ICS853S024AY REV. A APRIL 30, 2008

1...7 8 91011 12 13...16

中文翻译

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853S024AYLFT 替代型号

型号	品牌	替代类型	描述	数据表
8344BYLFT	IDT	功能相似	LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-LVCMOS FANOUT BUFFER
8344AY-01LF	IDT	功能相似	LOW SKEW, 1-TO-24 DIFFERENTIALTO-LVCMOS/LVTTL FANOUT BUFFER
853S024AYLF	IDT	类似代替	LOW SKEW, 1-TO-24 DIFFERENTIAL-TO-3.3V, 2.5V LVPECL FANOUT BUFFER

与853S024AYLFT相关器件

型号	品牌	获取价格	描述	数据表
853S031BYILF	IDT	获取价格	LVPECL/ECL Fanout Buffer
853S031BYILFT	IDT	获取价格	LVPECL/ECL Fanout Buffer
853S031I	RENESAS	获取价格	Low Skew,1-to-9 Differential-to-3.3V,2.5V LVPECL/ECL Fanout Buffer
853S057I	RENESAS	获取价格	4:1 Differential-to-3.3V, 2.5V LVPECL / ECL Clock Multiplexer
853S111AI	IDT	获取价格	Differential-to-LVPECL/ECL Fanout Buffer
853S111AI	RENESAS	获取价格	Low Skew,1-to-10 Differential-to-LVPECL/ECL Fanout Buffer
853S111AYILF	IDT	获取价格	Differential-to-LVPECL/ECL Fanout Buffer
853S111AYILFT	IDT	获取价格	Differential-to-LVPECL/ECL Fanout Buffer
853S111B	IDT	获取价格	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer
853S111B_16	IDT	获取价格	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer

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