Datasheet > 8430AY-71T

8430AY-71T

更新时间： 2023-01-02 21:08:11

品牌	Logo	应用领域
艾迪悌 - IDT		/
页数	文件大小	规格书
16页	210K
描述
Clock Generator, PQFP32

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8430AY-71T 数据手册

ICS8430-71

Integrated

Circuit

Systems, Inc.

700MH

Z, LOW

ITTER, CRYSTAL

NTERFACE

LVCMOS-TO-3.3V LVPECL FREQUENCY

SYNTHESIZER

POWER CONSIDERATIONS

This section provides information on power dissipation and junction temperature for the ICS8430-71.

Equations and example calculations are also provided.

1. Power Dissipation.

The total power dissipation for the ICS8430-71 is the sum of the core power plus the power dissipated in the load(s).

The following is the power dissipation for V_CC= 3.3V + 5% = 3.465V, which gives worst case results.

NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.

•

Power (core)_MAX= V_{CC_MAX}* I_{EE_MAX}= 3.465V * 140mA = 485mW

Power (outputs)_MAX= 30mW/Loaded Output pair

If all outputs are loaded, the total power is 2 * 30mW = 60mW

Total Power_{_MAX}(3.465V, with all outputs switching) = 485mW + 60mW = 545mW

2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the

device.The maximum recommended junction temperature for HiPerClockS^TMdevices is 125°C.

The equation for Tj is as follows: Tj = θ_JA* Pd_total + T_A

Tj = JunctionTemperature

θ_JA= Junction-to-AmbientThermal Resistance

Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)

T_A= AmbientTemperature

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ_JAmust be used. Assuming a

moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W perTable 8 below.

Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:

70°C + 0.545W * 42.1°C/W = 93°C. This is well below the limit of 125°C.

This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,

and the type of board (single layer or multi-layer).

TABLE 8. THERMAL R^ESISTANCEθ_JAFOR 32-PIN LQFP, FORCED CONVECTION

θ_JAbyVelocity (Linear Feet per Minute)

200

55.9°C/W

42.1°C/W

500

50.1°C/W

39.4°C/W

Single-Layer PCB, JEDEC Standard Test Boards

Multi-Layer PCB, JEDEC Standard Test Boards

67.8°C/W

47.9°C/W

NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.

8430AY-71

www.icst.com/products/hiperclocks.html

REV. B JANUARY 27, 2005

1...8 9 101112 13 14...16

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