74LVTH573WM PDF预览

74LVTH573WM

更新时间: 2025-09-22 19:51:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
12页 427K
描述
IC LATCH TRANSP OCT 3ST 20SOIC

74LVTH573WM 技术参数

是否无铅: 不含铅生命周期:Obsolete
包装说明:SOIC-20Reach Compliance Code:unknown
Factory Lead Time:1 week风险等级:5.64
Base Number Matches:1

74LVTH573WM 数据手册

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August 2024  
74LVT573, 74LVTH573  
Low Voltage Octal Transparent Latch with 3-STATE Outputs  
Features  
General Description  
Input and output interface capability to systems at  
The LVT573 and LVTH573 consist of eight latches  
with 3-STATE outputs for bus organized system applica-  
tions. The latches appear transparent to the data when  
Latch Enable (LE) is HIGH. When LE is low, the data  
satisfying the input timing requirements is latched. Data  
appears on the bus when the Output Enable (OE) is  
LOW. When OE is HIGbus output is in the high  
impedance state.  
5V V  
CC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH573),  
also available without bushold feature (74LVT573)  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
The LVTH573 daa inputs includbushold, eliminating  
the need for eteral pull-up resistors to hold unused  
inputs.  
Outputs source/sink –32mA/+64mA  
Functionally compatible with the 74 series 573  
Latch-up performance exceeds 500mA  
ESD performance:  
The oal latches are designed for low-voltage (3.3V)  
pplications, but with the capability to provide a TTL  
CC  
– Human-body model > 2000V  
– Machine model > 200V  
intrface to a 5V environmet. The LVT573 and  
LVTH573 are fabricated with an advanced BiCMOS  
technology to achieve high speed operation similar to 5V  
ABT while maintainng a low power dissipation.  
– Charged-device model > 1000V  
Ordering Information  
Package  
Order Numbumber  
Package Description  
74LVT573WM  
74LVT573SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVT573MSA  
74LVT573MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
74LVTH573WM  
74LVTH573SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVTH573MSA  
74LVTH573MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
www.fairchildsemi.com  
©1999 Fairchild Semiconductor Corporation  
74LVT573, 74LVTH573 Rev. 2.0  

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