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74LVTH574MTC PDF预览

74LVTH574MTC

更新时间: 2024-11-27 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 总线驱动器总线收发器触发器逻辑集成电路光电二极管信息通信管理
页数 文件大小 规格书
8页 111K
描述
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

74LVTH574MTC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSSOP
包装说明:TSSOP, TSSOP20,.25针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.13
其他特性:BROADSIDE VERSION OF 374系列:LVT
JESD-30 代码:R-PDSO-G20JESD-609代码:e4
长度:6.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:150000000 Hz
最大I(ol):0.064 A湿度敏感等级:1
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP20,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:RAIL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:4.5 ns传播延迟(tpd):5.3 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:FF/Latches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:4.4 mm
Base Number Matches:1

74LVTH574MTC 数据手册

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March 1999  
Revised March 2005  
74LVT574 74LVTH574  
Low Voltage Octal D-Type Flip-Flop  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT574 and LVTH574 are high-speed, low-power  
octal D-type flip-flop featuring separate D-type inputs for  
each flip-flop and 3-STATE outputs for bus-oriented appli-  
cations. A buffered Clock (CP) and Output Enable (OE) are  
common to all flip-flops.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH574),  
also available without bushold feature (74LVT574)  
The LVTH574 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
These octal flip-flops are designed for low-voltage (3.3V)  
VCC applications, but with the capability to provide a TTL  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 574  
Latch-up performance exceeds 500 mA  
ESD performance:  
interface to a 5V environment. The LVT574 and LVTH574  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining a low power dissipation.  
Human-body model 2000V  
Machine model 200V  
Charged-device model 1000V  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT574WM  
74LVT574SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVT574MSA  
74LVT574MTC  
MSA20  
MTC20  
MTC20  
74LVT574MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
74LVTH574WM  
74LVTH574SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVTH574MSA  
74LVTH574MTC  
MSA20  
MTC20  
MTC20  
74LVTH574MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
© 2005 Fairchild Semiconductor Corporation  
DS012451  
www.fairchildsemi.com  

74LVTH574MTC 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVTH574PWR TI

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