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74LCXH162374MEAX PDF预览

74LCXH162374MEAX

更新时间: 2024-09-11 23:24:19
品牌 Logo 应用领域
其他 - ETC 触发器逻辑集成电路光电二极管驱动
页数 文件大小 规格书
11页 223K
描述
16-Bit D-Type Flip-Flop

74LCXH162374MEAX 数据手册

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February 2001  
Revised August 2001  
74LCXH162374  
Low Voltage 16-Bit D-Type Flip-Flop with Bushold  
and 26Series Resistors in B Outputs  
General Description  
Features  
I 5V tolerant control inputs and outputs  
The LCXH162374 contains sixteen non-inverting D-type  
flip-flops with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is byte controlled. A buff-  
ered clock (CP) and Output Enable (OE) are common to  
each byte and can be shorted together for full 16-bit opera-  
tion.  
I 2.3V–3.6V VCC specifications provided  
I 7.0 ns tPD max (VCC = 3.3V), 20 µA ICC max  
I Power down high impedance inputs and outputs  
I
12 mA output drive (VCC = 3.0V)  
The LCXH162374 is designed for low voltage (2.5V or  
3.3V) VCC applications with capability of interfacing to a 5V  
I Implements patented noise/EMI reduction circuitry  
I Latch-up performance exceeds 500 mA  
I ESD performance:  
signal environment. The LCXH162374 data inputs include  
active bushold circuitry, eliminating the need for external  
pull-up resistors to hold unused or floating data inputs at a  
valid logic level. The 26series resistor in the output helps  
reduce output overshoot and undershoot.  
Human body model > 2000V  
Machine model > 200V  
I Equivalent 26series resistors on output  
I Bushold on inputs eliminates the need for external  
The LCXH162374 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
pull-up/pull-down resistors  
I Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LCXH162374GX  
(Note 1)  
BGA54A  
(Preliminary) [TAPE and REEL]  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LCXH162374MEA  
(Note 2)  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCXH162374MTD  
(Note 2)  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500446  
www.fairchildsemi.com  

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