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74LCXH16373 PDF预览

74LCXH16373

更新时间: 2024-09-11 22:34:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 锁存器
页数 文件大小 规格书
11页 222K
描述
Low Voltage 16-Bit Transparent Latch with Bushold

74LCXH16373 数据手册

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February 2001  
Revised August 2001  
74LCXH16373  
Low Voltage 16-Bit Transparent Latch with Bushold  
General Description  
Features  
The LCXH16373 contains sixteen non-inverting latches  
with 3-STATE outputs and is intended for bus oriented  
applications. The device is byte controlled. The flip-flops  
appear transparent to the data when the Latch Enable (LE)  
is HIGH. When LE is LOW, the data that meets the setup  
time is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH, the outputs are in  
a high impedance state.  
I 5V tolerant control inputs and outputs  
I 2.3V–3.6V VCC specifications provided  
I 5.4 ns tPD max (VCC = 3.3V), 20 µA ICC max  
I Bushold on inputs eliminates the need for external  
pull-up/pull-down resistors  
I Power down high impedance outputs  
I
24 mA output drive (VCC = 3.0V)  
The LCXH16373 is designed for low voltage (2.5V or 3.3V)  
I Implements patented noise/EMI reduction circuitry  
I Latch-up performance exceeds 500 mA  
I ESD performance:  
VCC applications with capability of interfacing to a 5V signal  
environment.  
The LCXH16373 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Human body model > 2000V  
Machine model > 200V  
The LCXH16373 data inputs include active bushold cir-  
cuitry, eliminating the need for external pull-up resistors to  
hold unused or floating data input at a valid logic level.  
I Also available in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCXH16373GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCXH16373MEA  
(Note 2)  
MS48A  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LCXH16373MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500440  
www.fairchildsemi.com  

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