February 2006
74LCX541
Low Voltage Octal Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
Features
General Description
■ 5V tolerant input and outputs
The LCX541 is an octal buffer/line driver designed to be
employed as memory and address drivers, clock drivers
and bus oriented transmitter/receivers. The LCX541 is a
non inverting option of the LCX540.
■ 2.3V–3.6V V specifications provided
CC
■ 6.5ns t max (V = 3.3V), 10µA I max
PD
CC
CC
■ Power-down high impedance inputs and outputs
1
This device is similar in function to the LCX244 while
providing flow-through architecture (inputs on opposite
side from outputs). This pinout arrangement makes this
device especially useful as an output port for micropro-
cessors, allowing ease of layout and greater PC board
density.
■ Supports live insertion/withdrawal
■ ±24 mA output drive (V = 3.0V)
CC
■ Implements patented noise/ EMI reduction circuitry
■ Latch-up performance exceeds JEDEC 78 conditions
■ ESD performance
– Human body model > 2000V
The LCX541 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX541 is fabricated with an advanced CMOS
technology to achieve high speed operation while
maintaining CMOS low power dissipation.
– Machine model > 200V
■ Leadless Pb-Free DQFN package
Ordering Information
Package
Order Number
74LCX541WM
74LCX541SJ
Number
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
M20D
2
74LCX541BQX
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
74LCX541MSA
74LCX541MTC
MSA20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
3
74LCX541MTC_NL
MTC20
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC
MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDED J-STD-020B.
Notes:
1. To ensure the high impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum
CC
value of the resistor is determined by the current-sourcing capability of the driver.
2. DQFN package available in Tape and Reel only.
3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
©2006 Fairchild Semiconductor Corporation
74LCX541 Rev. 2.0.0
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www.fairchildsemi.com