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73659-0001 PDF预览

73659-0001

更新时间: 2024-11-11 06:31:39
品牌 Logo 应用领域
莫仕 - MOLEX 电源电路插座
页数 文件大小 规格书
3页 104K
描述
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76μm (30μ")

73659-0001 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.69.40.30
风险等级:5.78其他特性:TUBE PACKAGING
主体宽度:0.445 inch主体深度:0.48 inch
主体长度:0.496 inch主体/外壳类型:RECEPTACLE
连接器类型:RECTANGULAR POWER CONNECTOR触点排列:S0P12
联系完成配合:NOT SPECIFIED联系完成终止:TIN OVER NICKEL
触点性别:FEMALE触点材料:NOT SPECIFIED
触点样式:BLADE PIN-SKTDIN 符合性:NO
空壳:NO滤波功能:NO
IEC 符合性:NO最大插入力:1.3066 N
绝缘体颜色:BLACK绝缘体材料:GLASS FILLED LIQUID CRYSTAL POLYMER
MIL 符合性:NO混合触点:NO
安装选项1:GUIDE SLOT安装选项2:LOCKING
安装方式:STRAIGHT安装类型:BOARD AND PANEL
连接器数:ONE选件:GENERAL PURPOSE
电镀厚度:30u inch参考标准:UL
可靠性:COMMERCIAL外壳材料:GLASS FILLED LIQUID CRYSTAL POLYMER
子类别:Headers and Edge Type Connectors端子长度:0.079 inch
端接类型:SOLDER触点总数:4
UL 易燃性代码:94V-0Base Number Matches:1

73659-0001 数据手册

 浏览型号73659-0001的Datasheet PDF文件第2页浏览型号73659-0001的Datasheet PDF文件第3页 
This document was generated on 05/14/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0736590001  
Active  
hdm  
Overview:  
Description:  
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,  
Power Receptacle, 12 Circuits, Gold (Au) 0.76µm (30µ")  
Documents:  
3D Model  
RoHS Certificate of Compliance (PDF)  
Drawing (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR19980  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
Not Reviewed  
Need more information on product  
environmental compliance?  
General  
Product Family  
Series  
Application  
Comments  
Component Type  
Overview  
Backplane Connectors  
73659  
Backplane  
Midplane Power Module  
Power Header  
hdm  
Product Name  
Style  
HDM®  
N/A  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
12  
Circuits (maximum)  
Color - Resin  
Durability (mating cycles max)  
First Mate / Last Break  
Flammability  
12  
Black  
250  
No  
Please visit the Contact Us section for any  
non-product compliance questions.  
94V-0  
Guide to Mating Part  
Keying to Mating Part  
Material - Metal  
No  
None  
Beryllium Copper  
Search Parts in this Series  
73659Series  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Number of Columns  
Number of Pairs  
Gold  
Tin  
Mates With  
73651 HDM® Board-to-Board  
Daughterboard Power Module  
High Temperature Thermoplastic  
1
Open Pin Field  
3
Number of Rows  
Orientation  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
Vertical  
0.079 In  
2.00 mm  
No  
PCB Retention  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.098 In  
2.50 mm  
Tube  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
0.079 In  
2.00 mm  
0.079 In  
2.00 mm  
30  
0.75  
150  
3.75  

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