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73659-0003

更新时间： 2024-11-07 06:31:39
品牌 Logo 应用领域
莫仕 - MOLEX 电源电路插座
页数 文件大小 规格书
3页 104K
描述
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76μm (30μ")

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中文翻译

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73659-0003 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：End Of LifeReach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8536.69.40.30
风险等级：5.76其他特性：TUBE PACKAGING
主体宽度：0.445 inch主体深度：0.48 inch
主体长度：0.496 inch主体/外壳类型：RECEPTACLE
连接器类型：RECTANGULAR POWER CONNECTOR触点排列：S0P12
联系完成配合：GOLD (150) OVER NICKEL联系完成终止：Tin (Sn) - with Nickel (Ni) barrier
触点性别：FEMALE触点材料：BERYLLIUM COPPER
触点样式：BLADE PIN-SKTDIN 符合性：NO
空壳：NO滤波功能：NO
IEC 符合性：NO最大插入力：1.3066 N
绝缘体颜色：BLACK绝缘体材料：GLASS FILLED LIQUID CRYSTAL POLYMER
JESD-609代码：e3MIL 符合性：NO
混合触点：NO安装选项1：GUIDE SLOT
安装选项2：LOCKING安装方式：STRAIGHT
安装类型：BOARD AND PANEL连接器数：ONE
选件：GENERAL PURPOSE电镀厚度：30u inch
参考标准：UL可靠性：COMMERCIAL
外壳材料：GLASS FILLED LIQUID CRYSTAL POLYMER子类别：Headers and Edge Type Connectors
端子长度：0.118 inch端接类型：SOLDER
触点总数：4UL 易燃性代码：94V-0
Base Number Matches：1

73659-0003 数据手册

 浏览型号73659-0003的Datasheet PDF文件第2页浏览型号73659-0003的Datasheet PDF文件第3页 
This document was generated on 05/14/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0736590003  
Active  
hdm  
Overview:  
Description:  
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,  
Power Receptacle, 12 Circuits, Gold (Au) 0.76µm (30µ")  
Documents:  
3D Model  
RoHS Certificate of Compliance (PDF)  
Drawing (PDF)  
Series  
image - Reference only  
China RoHS  
General  
Product Family  
Series  
Backplane Connectors  
73659  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Contains SVHC: No  
Halogen-Free  
Status  
Application  
Comments  
Component Type  
Overview  
Product Name  
Style  
Backplane  
Midplane Power Module  
Power Header  
hdm  
HDM®  
N/A  
Not Reviewed  
Physical  
Circuits (Loaded)  
Need more information on product  
environmental compliance?  
12  
Circuits (maximum)  
Color - Resin  
12  
Black  
250  
No  
No  
None  
Beryllium Copper  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Durability (mating cycles max)  
First Mate / Last Break  
Guide to Mating Part  
Keying to Mating Part  
Material - Metal  
Please visit the Contact Us section for any  
non-product compliance questions.  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Number of Columns  
Number of Pairs  
Gold  
Tin  
High Temperature Thermoplastic  
1
Open Pin Field  
3
Search Parts in this Series  
73659Series  
Number of Rows  
Mates With  
73651 HDM® Board-to-Board  
Daughterboard Power Module  
Orientation  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
Vertical  
0.118 In  
3.00 mm  
No  
PCB Retention  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.098 In  
2.50 mm  
Tube  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Polarized to PCB  
0.079 In  
2.00 mm  
0.079 In  
2.00 mm  
30  
0.75  
150  
3.75  
No  
Stackable  
No  
Surface Mount Compatible (SMC)  
Temperature Range - Operating  
Termination Interface: Style  
Yes  
-55°C to +105°C  
Through Hole  
123

中文翻译

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