73659-0004

更新时间： 2024-01-20 08:10:58

品牌	Logo	应用领域
莫仕 - MOLEX		电源电路插座
页数	文件大小	规格书
3页	104K
描述
2.00mm (.079") Pitch HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle

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73659-0004 数据手册

This document was generated on 05/14/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0736590004

Active

hdm

Overview:

Description:

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,

Power Receptacle, 12 Circuits, Gold (Au) 0.76µm (30µ")

Documents:

3D Model

RoHS Certificate of Compliance (PDF)

Drawing (PDF)

Series

image - Reference only

China RoHS

General

Product Family

Series

Backplane Connectors

73659

EU RoHS

ELV and RoHS

Compliant

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

Application

Comments

Component Type

Overview

Product Name

Style

Backplane

Midplane Power Module

Power Header

hdm

HDM®

N/A

Not Reviewed

Physical

Circuits (Loaded)

Need more information on product

environmental compliance?

Circuits (maximum)

Color - Resin

Black

250

None

Beryllium Copper

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Durability (mating cycles max)

First Mate / Last Break

Guide to Mating Part

Keying to Mating Part

Material - Metal

Please visit the Contact Us section for any

non-product compliance questions.

Material - Plating Mating

Material - Plating Termination

Material - Resin

Number of Columns

Number of Pairs

Gold

Tin

High Temperature Thermoplastic

Open Pin Field

Search Parts in this Series

73659Series

Number of Rows

Mates With

73651 HDM® Board-to-Board

Daughterboard Power Module

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Vertical

0.138 In

3.50 mm

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.098 In

2.50 mm

Tube

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to PCB

0.079 In

2.00 mm

0.079 In

2.00 mm

0.75

150

3.75

Stackable

Surface Mount Compatible (SMC)

Temperature Range - Operating

Termination Interface: Style

Yes

-55°C to +105°C

Through Hole

12 3

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