5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 73658-639LF | AMPHENOL |
获取价格 |
Board Connector, 39 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 73658-650 | AMPHENOL |
获取价格 |
Board Connector, 13 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 73658-650LF | AMPHENOL |
获取价格 |
Board Connector, 13 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 73658-651 | AMPHENOL |
获取价格 |
Board Connector, 29 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 73659-0001 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73659-0002 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73659-0003 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73659-0004 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Recep |
|
| 7365-F | MOLEX |
获取价格 |
Barrier Strip Terminal Block, 30A, 1 Row(s), 1 Deck(s) |
|
| 7365-P | MOLEX |
获取价格 |
Barrier Strip Terminal Block, 30A, 1 Row(s), 1 Deck(s) |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
