3.3 VOLT HIGH-DENSITY SUPERSYNC II™
NARROW BUS FIFO
131,072 x 18/262,144 x 9
262,144 x 18/524,288 x 9
IDT72V2103
IDT72V2113
FEATURES:
• Empty, Full and Half-Full flags signal FIFO status
• Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
• Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
• Program programmable flags by either serial or parallel means
• Select IDT Standard timing (using EF and FF flags) or First Word
Fall Through timing (using OR and IR flags)
• Output enable puts data outputs into high impedance state
• Easily expandable in depth and width
• JTAG port, provided for Boundary Scan function (BGA Only)
• Independent Read and Write Clocks (permit reading and writing
simultaneously)
• Choose among the following memory organizations:
IDT72V2103
IDT72V2113
⎯
⎯
131,072 x 18/262,144 x 9
262,144 x 18/524,288 x 9
• Functionally compatible with the IDT72V255LA/72V265LA and
IDT72V275/72V285 SuperSync FIFOs
• Up to 166 MHz Operation of the Clocks
• User selectable Asynchronous read and/or write ports (BGA Only)
• 6 ns read/write cycle time (4.0 ns access time)
• User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
• Big-Endian/Little-Endian user selectable byte representation
• 5V tolerant inputs
• Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
• Pin compatible to the SuperSync II (IDT72V223/72V233/72V243/
72V253/72V263/72V273/72V283/72V293)family
• Fixed, low first word latency
• Zero latency retransmit
• Auto power down minimizes standby power consumption
• Master Reset clears entire FIFO
• High-performance submicron CMOS technology
• Industrial temperature range (–40°C to +85°C) is available
• Green parts available, see ordering information
• Partial Reset clears data, but retains programmable settings
FUNCTIONAL BLOCK DIAGRAM
D0 -Dn (x9 or x18)
LD SEN
*Available on the
WEN WCLK/WR
*
BGA package only.
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
FLAG
LOGIC
WRITE CONTROL
LOGIC
ASYW
HF
*
RAM ARRAY
FWFT/SI
PFM
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
FSEL0
FSEL1
WRITE POINTER
READ POINTER
BE
CONTROL
LOGIC
IP
RT
RM
ASYR
READ
CONTROL
LOGIC
OUTPUT REGISTER
IW
OW
BUS
*
CONFIGURATION
MRS
PRS
RESET
LOGIC
RCLK/RD
*
REN
TCK
*
*
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
6119 drw01
*
Q0 -Qn (x9 or x18)
OE
*
*
IDTandtheIDTlogoareregisteredtrademarksofIntegratedDeviceTechnology,Inc.SuperSyncIIFIFOisatrademarkofIntegratedDeviceTechnology,Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
AUGUST 2014
1
©
2014 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-6119/16