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72SD3232BRPFH PDF预览

72SD3232BRPFH

更新时间: 2024-11-05 12:55:55
品牌 Logo 应用领域
麦斯威 - MAXWELL 动态存储器
页数 文件大小 规格书
41页 601K
描述
1 Gbit SDRAM

72SD3232BRPFH 技术参数

生命周期:Obsolete包装说明:DFP,
Reach Compliance Code:unknown风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:6 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDFP-F72
长度:29.312 mm内存密度:1073741824 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:72字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:32MX32封装主体材料:PLASTIC/EPOXY
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK座面最大高度:8.001 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:0.635 mm端子位置:DUAL
宽度:22.606 mmBase Number Matches:1

72SD3232BRPFH 数据手册

 浏览型号72SD3232BRPFH的Datasheet PDF文件第2页浏览型号72SD3232BRPFH的Datasheet PDF文件第3页浏览型号72SD3232BRPFH的Datasheet PDF文件第4页浏览型号72SD3232BRPFH的Datasheet PDF文件第5页浏览型号72SD3232BRPFH的Datasheet PDF文件第6页浏览型号72SD3232BRPFH的Datasheet PDF文件第7页 
72SD3232B  
1 Gbit SDRAM  
8-Meg X 32-Bit X 4-Banks  
FEATURES:  
DESCRIPTION:  
• 1 Gigabit ( 8-Meg X 32-Bit X 4-Banks)  
• RAD-PA radiation-hardened against natural space  
radiation  
Maxwell Technologies’ Synchronous Dynamic Random  
Access Memory (SDRAM) is ideally suited for space  
applications requiring high performance computing and  
high density memory storage. As microprocessors  
increase in speed and demand for higher density mem-  
ory escalates, SDRAM has proven to be the ultimate  
solution by providing bit-counts up to 1 Gigabits and  
speeds up to 100 Megahertz. SDRAMs represent a sig-  
nificant advantage in memory technology over traditional  
SRAMs including the ability to burst data synchronously  
at high rates with automatic column-address generation,  
the ability to interleave between banks masking pre-  
charge time, and the ability to randomly change column  
address during each clock cycle.  
Total Dose Hardness:  
>100 krad (Si), depending upon space mission  
• Excellent Single Event Effects:  
SEL > 85 MeV/mg/cm2 @ 25°C  
TH  
• JEDEC Standard 3.3V Power Supply  
• Clock Frequency: 100 MHz Operation  
• Operating tremperature: -55 to +125°C  
Auto Refresh  
• Single pulsed RAS  
• 2 Burst Sequence variations  
Sequential (BL =1/2/4/8)  
Interleave (BL = 1/2/4/8)  
• Programmable CAS latency: 2/3  
• Power Down and Clock Suspend Modes  
LVTTL Compatible Inputs and Outputs  
• Package: 72-Pin Flat Package  
Maxwell Technologies’ patented RAD-PAK® packaging  
technology incorporates radiation shielding in the micro-  
circuit package. It eliminates the need for box shielding  
for a lifetime in orbit or space mission. In a typical GEO  
orbit, RAD-PAK® provides greater than 100 krads(Si)  
radiation dose tolerance. This product is available with  
screening up to Maxwell technologies self-defined  
screening flow.  
06.11.08 REV 1  
1
All data sheets are subject to change without notice  
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com  
©2008 Maxwell Technologies  
All rights reserved.  

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