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71P74604S333BQ PDF预览

71P74604S333BQ

更新时间: 2024-11-06 19:24:23
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
22页 303K
描述
CABGA-165, Tray

71P74604S333BQ 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:CABGA
包装说明:13 X 15 MM, 1 MM PITCH, FBGA-165针数:165
Reach Compliance Code:not_compliantECCN代码:3A991
HTS代码:8542.32.00.41风险等级:5.91
最长访问时间:0.45 ns最大时钟频率 (fCLK):333 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:15 mm
内存密度:18874368 bit内存集成电路类型:QDR SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:1.5/1.8,1.8 V认证状态:Not Qualified
座面最大高度:1.2 mm最小待机电流:1.7 V
子类别:SRAMs最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:13 mmBase Number Matches:1

71P74604S333BQ 数据手册

 浏览型号71P74604S333BQ的Datasheet PDF文件第2页浏览型号71P74604S333BQ的Datasheet PDF文件第3页浏览型号71P74604S333BQ的Datasheet PDF文件第4页浏览型号71P74604S333BQ的Datasheet PDF文件第5页浏览型号71P74604S333BQ的Datasheet PDF文件第6页浏览型号71P74604S333BQ的Datasheet PDF文件第7页 
Advance  
Information  
IDT71P74204  
IDT71P74104  
IDT71P74804  
IDT71P74604  
18Mb Pipelined  
QDR™II SRAM  
Burst of 4  
Description  
Features  
TM  
The IDT QDRII Burst of four SRAMs are high-speed synchronous  
memories with independent, double-data-rate (DDR), read and write  
data ports. This scheme allows simultaneous read and write access for  
the maximum device throughput, with four data items passed with each  
read or write. Four data word transfers occur per clock cycle, providing  
quad-data-rate(QDR)performance. ComparingthiswithstandardSRAM  
common I/O (CIO), single data rate (SDR) devices, a four to one in-  
crease in data access is achieved at equivalent clock speeds. Consider-  
ing that QDRII allows clock speeds in excess of standard SRAM de-  
vices, the throughput can be increased well beyond four to one in most  
applications.  
18Mb Density (2Mx8, 2Mx9, 1Mx18, 512kx36)  
Separate, Independent Read and Write Data Ports  
Supports concurrent transactions  
-
Dual Echo Clock Output  
4-Word Burst on all SRAM accesses  
Multiplexed Address Bus One Read or One Write request  
per clock cycle  
DDR (Double Data Rate) Data Bus  
-
Four word burst data per two clock cycles on  
each port  
Four word transfers per clock cycle  
-
Using independent ports for read and write data access, simplifies  
system design by eliminating the need for bi-directional buses. All buses  
associated with the QDRII are unidirectional and can be optimized for  
signal integrity at very high bus speeds. The QDRII has scalable output  
impedance on its data output bus and echo clocks, allowing the user to  
tune the bus for low noise and high performance.  
Depth expansion through Control Logic  
HSTL (1.5V) inputs that can be scaled to receive signals  
from 1.4V to 1.9V.  
Scalable output drivers  
-
Can drive HSTL, 1.8V TTL or any voltage level  
from 1.4V to 1.9V.  
The QDRII has a single SDR address bus with read addresses and  
write addresses multiplexed. The read and write addresses interleave  
with each occurring a maximum of every other cycle. In the event that no  
operation takes place on a cycle, the subsequest cycle may begin with  
either a read or write. During write operations, the writing of individual  
bytes may be blocked through the use of byte or nibble write control  
signals.  
-
Output Impedance adjustable from 35 ohms to 70  
ohms  
1.8V Core Voltage (VDD)  
165-ball, 1.0mm pitch, 15mm x 17mm fBGA Package  
JTAG Interface  
The QDRII has echo clocks, which provide the user with a clock  
Functional Block Diagram  
(Note1)  
DATA  
D
REG  
WRITE DRIVER  
(Note2)  
(Note2)  
ADD  
SA  
REG  
(Note1)  
Q
18M  
MEMORY  
ARRAY  
R
CTRL  
LOGIC  
W
(Note3)  
BWx  
K
CLK  
CQ  
GEN  
K
CQ  
C
SELECT OUTPUT CONTROL  
C
6111 drw16  
Notes  
1) Represents 8 data signal lines for x8, 9 signal lines for x9, 18 signal lines for x18, and 36 signal lines for x36  
2) Represents 19 address signal lines for x8 and x9, 18 address signal lines for x18, and 17 address signal lines for x36.  
BW  
3) Represents 1 signal line for x9, 2 signal lines for x18, and four signal lines for x36. On x8 parts, the  
and there are 2 signal lines.  
is a “nibble write”  
MARCH 2004  
1
©2003 Integrated Device Technology, Inc. “QDR SRAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, IDT, and Micron Technology, Inc. “  
DSC-6111/00  

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