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5962-9679506MYA PDF预览

5962-9679506MYA

更新时间: 2024-11-27 20:29:39
品牌 Logo 应用领域
WEDC 静态存储器内存集成电路
页数 文件大小 规格书
25页 172K
描述
Standard SRAM, 256KX16, 20ns, CMOS, CDSO44, CERAMIC, SOJ-44

5962-9679506MYA 数据手册

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REVISIONS  
LTR  
DESCRIPTION  
DATE (YR-MO-DA)  
APPROVED  
A
B
Changes in accordance with NOR 5962-R159-97.  
96-12-20  
98-02-18  
Raymond Monnin  
Raymond Monnin  
Change to Table I; ICCDR, device type column. Updated boilerplate.  
ksr  
C
D
Correct E2 dimension on package X from 3.85 min and 3.95 max to  
.385 min and .395 max inches. Change the IOL test condition for VOL  
from 8 mA to 6 mA in Table I. Updated boilerplate. ksr  
04-10-27  
09-01-21  
Raymond Monnin  
Robert Heber  
Add device type 07, updated Table I for 07 device, corrected Figure  
3, and added package Z. ksr  
REV  
SHEET  
REV  
D
D
D
D
D
D
D
21  
D
D
22  
D
D
23  
D
D
24  
D
SHEET  
15  
16  
17  
18  
19  
20  
REV STATUS  
OF SHEETS  
REV  
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
SHEET  
1
2
3
4
10  
11  
12  
13  
14  
PMIC N/A  
PREPARED BY  
Gary L. Gross  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43218-3990  
http://www.dscc.dla.mil  
CHECKED BY  
STANDARD  
Jeff Bowling  
MICROCIRCUIT  
APPROVED BY  
Michael A. Frye  
DRAWING  
THIS DRAWING IS  
AVAILABLE  
MICROCIRCUIT, MEMORY,  
DIGITAL, 256K X 16 STATIC  
RANDOM ACCESS MEMORY  
(SRAM), MONOLITHIC SILICON  
FOR USE BY ALL  
DEPARTMENTS  
AND AGENCIES OF THE  
DEPARTMENT OF DEFENSE  
AMSC N/A  
DRAWING APPROVAL DATE  
96-05-17  
REVISION LEVEL  
SIZE  
A
CAGE CODE  
5962-96795  
67268  
D
SHEET  
1 OF 24  
DSCC FORM 2233  
APR 97  
5962-E129-09  

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