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2SJ355-T2-AZ PDF预览

2SJ355-T2-AZ

更新时间: 2024-01-02 19:00:11
品牌 Logo 应用领域
日电电子 - NEC ISM频段开关脉冲晶体管
页数 文件大小 规格书
6页 64K
描述
Power Field-Effect Transistor, 2A I(D), 30V, 0.6ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT PACKAGE-3

2SJ355-T2-AZ 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:POMM包装说明:SMALL OUTLINE, R-PSSO-F3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.3
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):2 A
最大漏极电流 (ID):2 A最大漏源导通电阻:0.6 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-F3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):2 W
最大脉冲漏极电流 (IDM):4 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

2SJ355-T2-AZ 数据手册

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2SJ355  
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)  
PARAMETER  
Drain Cut-Off Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = –30 V, VGS = 0  
MIN.  
TYP.  
–1.5  
MAX.  
–10  
UNIT  
µA  
µA  
V
Gate Leakage Current  
Gate Cut-Off Voltage  
IGSS  
VGS = –16/+10 V, VDS = 0  
VDS = –10 V, ID = –1 mA  
VDS = –10 V, ID = –1.0 A  
VGS = –4 V, ID = –1.0 A  
VGS = –10 V, ID = –1.0 A  
±10  
VGS(off)  
|yfs|  
–1.0  
1.0  
–2.0  
Forward Transfer Admittance  
Drain to Source On-State Resistance  
Drain to Source On-State Resistance  
Input Capacitance  
S
RDS(on)1  
RDS(on)2  
Ciss  
0.50  
0.26  
300  
245  
120  
5.5  
0.60  
0.35  
VDS = –10 V, VGS = 0,  
f = 1.0 MHz  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
ns  
nC  
Output Capacitance  
Coss  
Crss  
Reverse Transfer Capacitance  
Turn-On Delay Time  
td(on)  
tr  
VDD = –25 V, ID = –1.0 A  
VGS(on) = –10 V  
Rise Time  
32  
RG = 10 , RL = 25 Ω  
Turn-Off Delay Time  
td(off)  
tf  
110  
130  
12.2  
1.2  
Fall Time  
Gate Input Charge  
QG  
VDS = –24 V,  
VGS = –10 V,  
Gate to Source Charge  
Gate to Drain Charge  
QGS  
QGD  
trr  
ID = –1.8 A, IG = –2 mA  
4.6  
Internal Diode Reverse Recovery Time  
Internal Diode Reverse Recovery Charge  
IF = 2.0 A,  
95  
di/dt = 50 A/µs  
Qrr  
85  
TYPICAL CHARACTERISTICS (TA = 25 ˚C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
100  
FORWARD BIAS SAFE OPERATING AREA  
–10  
–5  
80  
60  
40  
20  
–2  
–1  
–0.5  
–0.2  
–0.1  
Single pulse  
–2  
DS - Drain to Source Voltage - V  
–0.05  
0
25  
50  
75  
100  
125  
150  
–0.5 –1  
–5 –10 –20  
–50 –100  
T
A
- Ambient Temperature - ˚C  
V
2

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