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2SC5353-TA3-T PDF预览

2SC5353-TA3-T

更新时间: 2024-11-30 04:26:07
品牌 Logo 应用领域
友顺 - UTC 晶体晶体管高压
页数 文件大小 规格书
5页 147K
描述
HIGH VOLTAGE NPN TRANSISTOR

2SC5353-TA3-T 技术参数

生命周期:Active零件包装代码:TO-220AB
包装说明:TO-220, 3 PIN针数:3
Reach Compliance Code:compliant风险等级:5.6
最大集电极电流 (IC):3 A集电极-发射极最大电压:800 V
配置:SINGLE最小直流电流增益 (hFE):15
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e0元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:NPN表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

2SC5353-TA3-T 数据手册

 浏览型号2SC5353-TA3-T的Datasheet PDF文件第2页浏览型号2SC5353-TA3-T的Datasheet PDF文件第3页浏览型号2SC5353-TA3-T的Datasheet PDF文件第4页浏览型号2SC5353-TA3-T的Datasheet PDF文件第5页 
2SC5353  
TOSHIBA Transistor Silicon NPN Triple Diffused Type (PCT process)  
2SC5353  
Switching Regulator and High Voltage Switching  
Applications  
Unit: mm  
High-Speed DC-DC Converter Applications  
Excellent switching times: t = 0.7 μs (max), t = 0.5 μs (max)  
r
f
High collectors breakdown voltage: V  
= 800 V  
CEO  
Absolute Maximum Ratings (Tc = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
900  
V
V
V
Collector-emitter voltage  
Emitter-base voltage  
800  
7
DC  
I
3
C
Collector current  
Base current  
A
A
Pulse  
I
5
CP  
I
1
2.0  
B
JEDEC  
JEITA  
Ta = 25°C  
Tc = 25°C  
Collector power  
dissipation  
P
W
C
SC-67  
2-10R1A  
25  
TOSHIBA  
Junction temperature  
T
150  
°C  
°C  
j
Weight: 1.7 g (typ.)  
Storage temperature range  
T
stg  
55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report  
and estimated failure rate, etc).  
1
2006-11-10  

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