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2SC5107TE85R PDF预览

2SC5107TE85R

更新时间: 2024-11-24 14:46:23
品牌 Logo 应用领域
东芝 - TOSHIBA 放大器光电二极管晶体管
页数 文件大小 规格书
6页 331K
描述
TRANSISTOR UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, BIP RF Small Signal

2SC5107TE85R 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.21.00.75风险等级:5.74
最大集电极电流 (IC):0.03 A基于收集器的最大容量:0.9 pF
集电极-发射极最大电压:10 V配置:SINGLE
最小直流电流增益 (hFE):80最高频带:ULTRA HIGH FREQUENCY BAND
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:125 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:NPN
认证状态:Not Qualified表面贴装:YES
端子面层:TIN LEAD端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):6000 MHzBase Number Matches:1

2SC5107TE85R 数据手册

 浏览型号2SC5107TE85R的Datasheet PDF文件第2页浏览型号2SC5107TE85R的Datasheet PDF文件第3页浏览型号2SC5107TE85R的Datasheet PDF文件第4页浏览型号2SC5107TE85R的Datasheet PDF文件第5页浏览型号2SC5107TE85R的Datasheet PDF文件第6页 
2SC5107  
TOSHIBA Transistor Silicon NPN Epitaxial Planar Type  
2SC5107  
For VCO Application  
Unit: mm  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
20  
V
V
Collector-emitter voltage  
Emitter-base voltage  
Base current  
10  
3
15  
V
I
mA  
mA  
mW  
°C  
°C  
B
Collector current  
I
30  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
100  
C
T
j
125  
T
stg  
55 to 125  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
SC-70  
2-2E1A  
TOSHIBA  
Weight: 6 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure rate, etc).  
1
2010-03-30  

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