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2N7225U1 PDF预览

2N7225U1

更新时间: 2024-11-24 07:29:15
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SEME-LAB /
页数 文件大小 规格书
2页 26K
描述
N–CHANNEL POWER MOSFET

2N7225U1 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-276AB
包装说明:CHIP CARRIER, R-CBCC-N3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.29雪崩能效等级(Eas):500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):27.4 A
最大漏源导通电阻:0.105 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-276ABJESD-30 代码:R-CBCC-N3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):110 A
认证状态:Not Qualified表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON

2N7225U1 数据手册

 浏览型号2N7225U1的Datasheet PDF文件第2页 
IRFN250  
2N7225U1  
MECHANICAL DATA  
Dimensions in mm (inches)  
N–CHANNEL  
POWER MOSFET  
0
.
8
9
(
0
.
0
3
5
)
m
i
n
.
3
3
.
.
7
4
0
1
(
(
0
0
.
.
1
1
4
3
6
4
)
)
3
3
.
.
7
4
0
1
(
(
0
0
.
.
1
1
4
3
6
4
)
)
3
.
6
0
(
0
.
1
4
2
)
VDSS  
200V  
M
a
x
.
ID(cont)  
RDS(on)  
27.4A  
1
3
0.100  
FEATURES  
2
• HERMETICALLY SEALED SURFACE  
MOUNT PACKAGE  
• SMALL FOOTPRINT – EFFICIENT USE OF  
PCB SPACE.  
9
9
.
.
6
3
7
8
(
(
0
0
.
.
3
3
8
6
1
9
)
)
• SIMPLE DRIVE REQUIREMENTS  
0
0
.
.
5
2
0
6
)
)
(
(
0
0
.
.
0
0
2
1
0
0
1
1
1
1
.
.
5
2
8
8
(
(
0
0
.
.
4
4
5
4
6
4
)
)
• LIGHTWEIGHT  
• HIGH PACKING DENSITIES  
SMD 1 PACKAGE (TO-276AB)  
Pad 1 – Source  
Pad 2 – Drain  
Pad 3 – Gate  
Note: IRF250SMD also available with  
pins 1 and 3 reversed.  
ABSOLUTE MAXIMUM RATINGS (T  
= 25°C unless otherwise stated)  
case  
V
Gate – Source Voltage  
Continuous Drain Current  
Continuous Drain Current  
±20V  
27.4A  
GS  
I
I
I
(V = 0 , T  
= 25°C)  
D
GS  
case  
case  
(V = 0 , T  
= 100°C)  
17A  
D
GS  
1
Pulsed Drain Current  
110A  
DM  
P
Power Dissipation @ T = 25°C  
case  
150W  
D
Linear Derating Factor  
1.2W/°C  
500mJ  
2
E
Single Pulse Avalanche Energy  
AS  
3
dv/dt  
T , T  
Peak Diode Recovery  
5.0V/ns  
–55 to 150°C  
300°C  
Operating and Storage Temperature Range  
J
stg  
T
Package Mounting Surface Temperature (for 5 sec)  
Thermal Resistance Junction to Case  
L
R
0.83°C/W  
θJC  
Notes 1) Pulse Test: Pulse Width 300ms, δ ≤ 2%  
2) @ V = 25V , L 1.3mH , Peak I = 27.4A , Starting T = 25°C  
DD  
L
J
3) @ I 27.5A , di/dt 190A/µs , V BV  
, T 150°C  
J
SD  
DD  
DSS  
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed  
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.  
Semelab encourages customers to verify that datasheets are current before placing orders.  
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.  
Document Number 3352  
Issue 2  
E-mail: sales@semelab.co.uk  
Website: http://www.semelab.co.uk  

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