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27C128_04 PDF预览

27C128_04

更新时间: 2024-11-27 04:25:39
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
10页 147K
描述
128K (16K x 8) CMOS EPROM

27C128_04 数据手册

 浏览型号27C128_04的Datasheet PDF文件第2页浏览型号27C128_04的Datasheet PDF文件第3页浏览型号27C128_04的Datasheet PDF文件第4页浏览型号27C128_04的Datasheet PDF文件第5页浏览型号27C128_04的Datasheet PDF文件第6页浏览型号27C128_04的Datasheet PDF文件第7页 
Obsolete Device  
27C128  
128K (16K x 8) CMOS EPROM  
FEATURES  
PACKAGE TYPES  
DIP/SOIC  
• High speed performance  
- 120 ns access time available  
VPP • 1  
28 VCC  
27 PGM  
26 A13  
25 A8  
24 A9  
23 A11  
22 OE  
21 A10  
20 CE  
19 O7  
18 O6  
17 O5  
16 O4  
15 O3  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
O0  
O1  
O2  
2
• CMOS Technology for low power consumption  
- 20 mA Active current  
3
4
5
- 100 µA Standby current  
6
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• Separate chip enable and output enable controls  
• High speed “express” programming algorithm  
• Organized 16K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
7
8
9
10  
11  
12  
13  
VSS 14  
- 32-pin PLCC Package  
- 28-pin SOIC package  
PLCC  
- Tape and reel  
• Available for the following temperature ranges:  
- Commercial:  
- Industrial:  
0°C to +70°C  
5
29  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
NC  
A8  
A9  
A11  
NC  
OE  
A10  
CE  
O7  
O6  
6
28  
-40°C to +85°C  
-40°C to +125°C  
7
27  
- Automotive:  
8
26  
25  
24  
23  
22  
21  
9
10  
DESCRIPTION  
11  
12  
The Microchip Technology Inc. 27C128 is a CMOS  
128K bit (electrically) Programmable Read Only Mem-  
ory. The device is organized as 16K words by 8 bits  
(16K bytes). Accessing individual bytes from an  
address transition or from power-up (chip enable pin  
going low) is accomplished in less than 120 ns. CMOS  
design and processing enables this part to be used in  
systems where reduced power consumption and high  
reliability are requirements.A complete family of pack-  
ages is offered to provide the most flexibility in applica-  
tions. For surface mount applications, PLCC, SOIC, or  
TSOP packaging is available. Tape and reel packaging  
is also available for PLCC or SOIC packages. UV eras-  
able versions are also available.  
13  
O0  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC or SOIC packaging is available. Tape  
and reel packaging is also available for PLCC or SOIC  
packages.  
2004 Microchip Technology Inc.  
DS11003L-page 1  

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