Model 1722B50-100J
Rev A
Ultra Low Profile 0805 Balun
50Ω to 200Ω Balanced
Description
The 1722B50-100J is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering the UMTS,
PCS, DCS and CDMA frequencies. The 1722B50-100J is ideal for high volume
manufacturing and is higher performance than traditional ceramic, and lumped
element baluns. The 1722B50-100J has an unbalanced port impedance of 50Ω and
a 200Ω balanced port impedance**. This transformation enables single ended
signals to be applied to differential ports on modern semiconductors. The output
ports have equal amplitude (-3dB) with 180 degree phase differential. The 1722B50-
100J is available on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications*: Specifications subject to change without notice.
ROOM (25°C)
Features:
Parameter
Frequency
Min.
1.7
Typ.
Max
2.2
Unit
GHz
Ω
• 1.7 – 2.2 GHz
• 0.7mm Height Profile
• 50 Ohm to 2 x 100 Ohm
• DCS/PCS/ UMTS/CDMA
• Low Insertion Loss
• Input to Output DC Isolation
• Surface Mountable
• Tape & Reel
Unbalanced Port Impedance
Balanced Port Impedance**
Return Loss
Insertion Loss***
Amplitude Balance
Phase Balance
Power Handling
Thermal Resistance
Operating Temperature
50
200
20
0.5
±0.6
±4
Ω
15
dB
dB
dB
0.7
±0.9
±8
0.5
TBD
+85
Degrees
Watts
ºC / Watt
ºC
• Non-conductive Surface
-55
*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50 Ω nominal impedance.
P** i1n00ΩCorefnerfeingcue troagtrioounnd. *** Insertion Loss stated at room temperature (0.8 dB Max at +85 ºC)
The internal configuration of the ultra-low profile balun is diagramed to
the left; the unbalanced port is terminated in an open-circuit and the
two balanced ports are connected to ground. The ground connection
for the two balanced ports are connected together and brought out on
a common pin of the balun. This pin is labeled “DC/RF ground”. For
many chipset applications there is an opportunity to use this
configuration as a single bias point if applicable.
Balun Pin Configruation
λ 4
The use of differential circuits is increasing in highly integrated circuits,
because of its inherent noise immunity properties. Differential circuits
have superior performance when looking at properties like cross
coupling, immunity to external noise sources and power supply noise.
When designing power amplifiers differential circuits also help
minimize 2nd and 3rd order intermodulation products.
λ 4
The construction of the ultra-low profile balun is bonded multi-layered
stripline made of low loss dielectric material with plated through vias
connecting the internal circuitry to the external printed circuit board,
similar to that of other Xinger hybrids and directional couplers.
USA/Canada:
Toll Free:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape
and Reel for Pick and
Place Manufacturing.
Europe: