Datasheet > 1722B50-75J

1722B50-75J

更新时间： 2024-02-12 11:02:12

品牌	Logo	应用领域
安伦 - ANAREN		变压器
页数	文件大小	规格书
12页	676K
描述
RF Transformer, 1700MHz Min, 2200MHz Max

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1722B50-75J 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
ECCN代码：	EAR99	风险等级：	5.66
最大截止频率：	2200 MHz	最小截止频率：	1700 MHz
高度：	0.7 mm	插入损耗：	0.8 dB
长度：	2.03 mm	安装特点：	SURFACE MOUNT
最高工作温度：	85 °C	最低工作温度：	-55 °C
包装方法：	TAPE & REEL	物理尺寸：	2.03mm X 1.27mm X 0.7mm
表面贴装：	YES	变压器类型：	RF TRANSFORMER
宽度：	1.27 mm	Base Number Matches：	1

1722B50-75J 数据手册

Model 1722B50-75J

Rev A

Ultra Low Profile 0805 Balun

50Ω to 150Ω Balanced

Description

The 1722B50-75J is a low profile sub-miniature balanced to unbalanced

transformer designed for differential inputs and output locations on next generation

wireless chipsets in an easy to use surface mount package covering the DCS, PCS,

UMTS and CDMA frequencies. The 1722B50-75J is ideal for high volume

manufacturing and is higher performance than traditional ceramic, and lumped

element baluns. The 1722B50-75J has an unbalanced port impedance of 50Ω and

a 150Ω balanced port impedance**. This transformation enables single ended

signals to be applied to differential ports on modern semicondoctors. The output

ports have equal amplitude (-3dB) with 180 degree phase differential. The 1722B50-

75J is available on tape and reel for pick and place high volume manufacturing.

Detailed Electrical Specifications*: Specifications subject to change without notice.

ROOM (25°C)

Features:

Parameter

Frequency

Min.

1.7

Typ.

Max

2.2

Unit

GHz

Ω

• 1.7 – 2.2 GHz

• 0.7mm Height Profile

• 50 Ohm to 2 x 75 Ohm

• DCS/PCS/ UMTS/CDMA

• Low Insertion Loss

• Input to Output DC Isolation

• Surface Mountable

• Tape & Reel

Unbalanced Port Impedance

Balanced Port Impedance**

Return Loss

Insertion Loss***

Amplitude Balance

Phase Balance

Power Handling

Thermal Resistance

Operating Temperature

150

0.5

±0.7

±2

Ω

0.7

±1.0

±5

0.5

TBD

+85

Degrees

Watts

ºC / Watt

ºC

• Non-conductive Surface

-55

*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50 Ω nominal impedance.

P^**i⁷n^5ΩC^reo^fen^refⁿi^cg^eu^tor^ga^roti^uo^ndn^{. *** Insertion Loss stated at room temperature (0.8 dB Max at +85 ºC)}

The internal configuration of the ultra-low profile balun is diagramed to

the left; the unbalanced port is terminated in an open-circuit and the

two balanced ports are connected to ground. The ground connection

for the two balanced ports are connected together and brought out on

a common pin of the balun. This pin is labeled “DC/RF ground”. For

many chipset applications there is an opportunity to use this

configuration as a single bias point if applicable.

Balun Pin Configruation

λ 4

The use of differential circuits is increasing in highly integrated circuits,

because of its inherent noise immunity properties. Differential circuits

have superior performance when looking at properties like cross

coupling, immunity to external noise sources and power supply noise.

When designing power amplifiers differential circuits also help

minimize 2^ndand 3^rdorder intermodulation products.

λ 4

The construction of the ultra-low profile balun is bonded multi-layered

stripline made of low loss dielectric material with plated through vias

connecting the internal circuitry to the external printed circuit board,

similar to that of other Xinger hybrids and directional couplers.

USA/Canada:

Toll Free:

(315) 432-8909

(800) 411-6596

+44 2392-232392

Available on Tape

and Reel for Pick and

Place Manufacturing.

Europe:

12 3 4 5 6 7...12

中文翻译

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1723052	PHOENIX	获取价格	MSTB 2,5/ 6-ST-5,08 LUB
172306	AMPHENOL	获取价格	Connector Accessory

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