ZSSC3026
Table of Contents
1
IC Characteristics ............................................................................................................................................. 6
1.1. Absolute Maximum Ratings....................................................................................................................... 6
1.2. Operating Conditions................................................................................................................................. 6
1.3. Electrical Parameters ................................................................................................................................ 7
1.4. Power Supply Rejection Ratio (PSRR) vs. Frequency............................................................................ 10
Circuit Description .......................................................................................................................................... 11
2.1. Brief Description ...................................................................................................................................... 11
2.2. Signal Flow and Block Diagram............................................................................................................... 11
2.3. Analog Front End..................................................................................................................................... 12
2.3.1. Amplifier ............................................................................................................................................ 12
2.3.2. Analog-to-Digital Converter............................................................................................................... 14
2.3.3. Temperature Measurement .............................................................................................................. 18
2.3.4. Bridge Supply.................................................................................................................................... 18
2.4. Digital Section.......................................................................................................................................... 18
2.4.1. Digital Signal Processor (DSP) Core ................................................................................................ 18
2.4.2. MTP Memory..................................................................................................................................... 18
2.4.3. Clock Generator................................................................................................................................ 19
2.4.4. Power Supervision ............................................................................................................................ 19
2.4.5. Interface ............................................................................................................................................ 19
Functional Description.................................................................................................................................... 20
3.1. Power Up................................................................................................................................................. 20
3.2. Measurements......................................................................................................................................... 20
3.3. Operational Modes .................................................................................................................................. 20
3.4. Command Interpretation.......................................................................................................................... 23
3.4.1. SPI/I2C™ Commands ....................................................................................................................... 23
3.5. Communication Interface......................................................................................................................... 25
3.5.1. Common Functionality ...................................................................................................................... 25
3.5.2. SPI .................................................................................................................................................... 27
3.5.3. I2C™.................................................................................................................................................. 31
3.6. Memory.................................................................................................................................................... 32
3.6.1. Programming Memory ...................................................................................................................... 33
3.6.2. Memory Status Commands .............................................................................................................. 33
3.6.3. Memory Contents.............................................................................................................................. 34
3.7. Calibration Sequence .............................................................................................................................. 40
3.7.1. Calibration Step 1 – Assigning Unique Identification........................................................................40
3.7.2. Calibration Step 2 – Data Collection................................................................................................. 40
3.7.3. Calibration Step 3 – Coefficient Calculations.................................................................................... 41
3.8. The Calibration Math ............................................................................................................................... 42
3.8.1. Bridge Signal Compensation ............................................................................................................ 42
3.8.2. Temperature Signal Compensation .................................................................................................. 44
Die and Package Characteristics ................................................................................................................... 45
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© 2016 Integrated Device Technology, Inc.
3
March 28, 2016
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