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ZA1-40-2-1.00-Z-10 PDF预览

ZA1-40-2-1.00-Z-10

更新时间： 2024-09-17 19:04:35
品牌 Logo 应用领域
申泰 - SAMTEC /
页数 文件大小 规格书
6页 811K
描述
IC Socket

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ZA1-40-2-1.00-Z-10 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：compliantFactory Lead Time：3 weeks
风险等级：2.22主体宽度：0.433 inch
主体深度：0.039 inch主体长度：1.902 inch
触点的结构：40X10联系完成终止：Gold (Au) - with Nickel (Ni) barrier
触点样式：COMPRESSION目前评级：1 A
设备插槽类型：IC SOCKETJESD-609代码：e4
插接触点节距：0.039 inch安装方式：STRAIGHT
触点数：400最高工作温度：105 °C
最低工作温度：-55 °C端子节距：0.039 mm
Base Number Matches：1

ZA1-40-2-1.00-Z-10 数据手册

 浏览型号ZA1-40-2-1.00-Z-10的Datasheet PDF文件第2页浏览型号ZA1-40-2-1.00-Z-10的Datasheet PDF文件第3页浏览型号ZA1-40-2-1.00-Z-10的Datasheet PDF文件第4页浏览型号ZA1-40-2-1.00-Z-10的Datasheet PDF文件第5页浏览型号ZA1-40-2-1.00-Z-10的Datasheet PDF文件第6页 
ZA1-XX-X-X.XX-X-XX-X  
DESIGNED & DIMENSIONED  
IN MILLIMETERS[INCHES]  
REVISION G  
SOLDER COMPOSITION  
No OF POSITIONS (PER ROW)  
-10, -20,- 30,- 40  
LEAVE BLANK FOR -2 COMPRESSION  
-1: LEAD (63% Sn/37% Pb)  
COMPRESSION  
**-1: SINGLE  
(SOLDER BALL SIDE 2)  
-2: DUAL  
DO NOT  
SCALE FROM  
THIS PRINT  
-2: LEAD-FREE (96.5% Sn/3% Ag/.5% Cu)  
C16  
ROW SPECIFICATION  
-10: 10 ROWS  
"A"  
"B"  
HEIGHT  
PLATING SPECIFICATION  
-1.00  
C1  
2.80 .110 REF  
"C" REF  
-Z: 6µ" MIN Au C15 OVER 40-100µ" Ni C20  
*-S: 30µ" MIN Au C15 OVER 40-100µ" Ni C20  
C2  
1.250 .0492  
1.067 .0420  
-A-  
* NOT RELEASED  
C4  
1.80 .071  
0.05  
Z
Y
A
"A"  
** ONLY AVAILABLE IN -10 & -20 POSITIONS  
-30 & -40 POSITION NOT RELEASED  
C3 1.847 .0727  
"A"  
K
J
0.80 .031  
H
G
F
2.900 .1142  
C17  
11.00 .433  
-Y-  
C
L
E
9.00 .354  
D
C
B
REF  
C22  
2.000 .0787  
(SEE NOTE 3)  
A
1.00 .039  
REF (TYP)  
10  
1
2
1.50 .059  
(TYP)  
C
L
'B'  
1.00 .039 (TYP) REF  
POSITION 1 INDICATOR  
THROUGH COVERFILM ONLY  
DETAIL 'B'  
SCALE 10 : 1  
FIG 1  
ZA1-10-2-1.00-X-10 SHOWN  
(DUAL COMPRESSION)  
(SOME CENTER FEATURES REMOVED FOR CLARITY)  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. CONTACT POINTS ARE MEASURED IN UNCOMPRESSED STATE.  
3. RECOMMENDED SCREW SIZE: M1.6  
4. ELECTRICAL TEST: TESTED TO STANDARD  
PROPRIETARY NOTE  
THIS DOCUMENT CONTAINS CONFIDENTIAL AND  
PROPRIETARY INFORMATION AND ALL DESIGN,  
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS  
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,  
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE  
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR  
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY  
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS  
WRITTEN CONSENT OF SAMTEC, INC.  
*
*
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN MILLIMETERS.  
TOLERANCES ARE:  
C7  
100% ISOLATION & CONTINUITY TESTS REQUIRED  
100% HI-POT REQUIRED AT 300V  
DECIMALS  
ANGLES  
MINIMUM PIN TO PIN ISOLATION TO BE 200 MEGA OHMS  
5. PARTS TO BE PACKAGED IN TRAYS.  
X.X: 0.3 [.01]  
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
X.XX: 0.13 [.005]  
PHONE: 812-944-6733  
e-Mail info@SAMTEC.com  
FAX: 812-948-5047  
X.XXX: 0.051 [.0020]  
6. DIMENSION AFTER FINAL REFLOW IS 1.000[.0394].  
code 55322  
SHEET SCALE: 2:1  
MATERIAL:  
DO NOT SCALE DRAWING  
7. MAXIMUM BURR AFTER DICING: 0.125[.005].  
DESCRIPTION:  
CONTACT: BeCu  
CORE: FR4  
8. PARTS TO BE PROCESSED PER SAMTEC WORKMANSHIP GUIDELINES: NA-ZR-WI-3015-M.  
9. PAD SIZE IS DEFINED BY SOLDERMASK OPENING; SOLDERMASK THICKNESS IS 0.0254±0.0127mm  
10. TOTAL STACK HEIGHT OF MATERIAL LAYERS IS REPRESENTED IN CONTACT ARRAY AREA.  
AREAS OUTSIDE OF THE ARRAY HAVE THE FOIL LAYER REMOVED RESULTING IN THINNER  
PROFILE DIMENSION OUTSIDE OF ARRAY.  
1.0mm PITCH ZRAY ASSEMBLY  
COVERLAY: POLYIMIDE  
DWG.ZA1-XX-X-X.XX-X-XX-X  
NO.  
BY:  
D.SCHMELZ 01/08/2014 SHEET 1 OF 6  
F:\DWG\MISC\MKTG\ZA1-XX-X-X.XX-X-XX-X-MKT.SLDDRW  
123456

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