Datasheet > XT290SN

XT290SN

更新时间： 2024-09-14 01:21:27

品牌	Logo	应用领域
MARKTECH		/
页数	文件大小	规格书
6页	287K
描述
LEDs

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XT290SN 数据手册

XThin LEDs

CxxxXT290-Sxx00-x

Cree’s XThin LEDs are the next generation of solid-state LED emitters that combine highly efﬁcient InGaN materials

with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED

chips have a geometrically enhanced Epi-down design to maximize light extraction efﬁciency and require only a

single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and

require a low forward voltage. Cree’s XT™ chips are tested for conformity to optical and electrical speciﬁcations

and the ability to withstand 1000V ESD. Applications for XThin include next-generation mobile appliances for use

in their LCD backlights and digital camera ﬂash where brightness, sub-miniaturization, and low power consumption

are required.

FEATURES

APPLICATIONS

•

XThin LED Performance

•

SMT Packages

Cellular Phone LCD Backlighting

Digital Camera Flash

–

Blue



XT-12™ – 12.0 mW min.

XT-16™ – 16.0 mW min.

XT-18™ – 18.0 mW min.

XT-21™ – 21.0 mW min.

XT-24™ – 24.0 mW min.

Mobile Appliance Key Pads

–

White LEDs

Blue LEDs

•

LED Video Displays

–

Green – 7.0 mW min.

•

Low Forward Voltage – 3.2 V Typical at 20 mA

Class 2 ESD Rating

Sn Contact for Low-Temp. Die Attach Methods

Die Attach Options

–

Flux Eutectic; Flux & Temperature (-C)

Eutectic; Temperature & Pressure (-D)

CxxxXT290-Sxx00-x Chip Diagram

Top View

Bottom View

Die Cross Section

G•SiC LED Chip

300 x 300 μm

Backside

Contact

Metal

Gold Bond Pad

105 μm Diameter

Cathode (-)

Bottom View for -C

Bottom View for -D

SiC Substrate

t = 115 µm

Anode (+)

Subject to change without notice.

www.cree.com

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