Datasheet > XPC755BRX300LD

XPC755BRX300LD

更新时间： 2024-01-07 01:37:04

品牌	Logo	应用领域
摩托罗拉 - MOTOROLA		时钟外围集成电路
页数	文件大小	规格书
76页	1751K
描述
IC,MICROPROCESSOR,64-BIT,CMOS,BGA,360PIN,CERAMIC

阅读下载

中文翻译

获取价格

如果您发现信息不准确，欢迎纠错

XPC755BRX300LD 数据手册

Advance Information

MPC755EC/D

Rev. 6, 9/2002

MPC755

RISC Microprocessor

Hardware Specifications

This document is primarily concerned with the MPC755; however, unless otherwise noted, all

information here also applies to the MPC745. The MPC755 and MPC745 are reduced

instruction set computing (RISC) microprocessors that implement the PowerPC instruction

set architecture. This document describes pertinent physical characteristics of the MPC755.

For functional characteristics of the processor, refer to the MPC750 RISC Microprocessor

Family User’s Manual.

This document contains the following topics:

Topic

Page

Section 1.1, “Overview”

Section 1.2, “Features”

Section 1.3, “General Parameters”

Section 1.4, “Electrical and Thermal Characteristics”

Section 1.5, “Pin Assignments”

Section 1.6, “Pinout Listings”

Section 1.7, “Package Description”

Section 1.8, “System Design Information”

Section 1.9, “Document Revision History”

Section 1.10, “Ordering Information”

To locate any published errata or updates for this document, refer to the website at

http://www.motorola.com/semiconductors.

1.1 Overview

The MPC755 is targeted for low-cost, low-power systems and supports the following power

management features—doze, nap, sleep, and dynamic power management. The MPC755

consists of a processor core and an internal L2 tag combined with a dedicated L2 cache

interface and a 60x bus. The MPC745 is identical to the MPC755 except it does not support

the L2 cache interface.

Figure 1 shows a block diagram of the MPC755.

12 3 4 5 6 7...76

中文翻译

下载PDF

型号	品牌	获取价格	描述	数据表
XPC755BRX300LE	NXP	获取价格	32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC755BRX300LE	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, CERAMIC, BGA-360
XPC755BRX350LB	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PI
XPC755BRX350LD	MOTOROLA	获取价格	IC,MICROPROCESSOR,64-BIT,CMOS,BGA,360PIN,CERAMIC
XPC755BRX350LE	MOTOROLA	获取价格	32-BIT, 350MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360
XPC755BRX350TE	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PI
XPC755BRX400LB	MOTOROLA	获取价格	32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC755BRX400LD	ETC	获取价格	Microprocessor
XPC755BRX400LE	MOTOROLA	获取价格	32-BIT, 400 MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360
XPC755BRX400TE	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PI