生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 360 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.27 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 100 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B360 |
长度: | 25 mm | 低功率模式: | YES |
端子数量: | 360 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 2.77 mm | 速度: | 400 MHz |
最大供电电压: | 2.1 V | 最小供电电压: | 1.9 V |
标称供电电压: | 2 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC755CRX400 | NXP |
获取价格 |
32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC755CRX400LE | MOTOROLA |
获取价格 |
32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | |
XPC755CRX450LE | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC | |
XPC801ZP25 | MOTOROLA |
获取价格 |
32-BIT, 25MHz, MICROPROCESSOR, PBGA256, BGA-256 | |
XPC801ZP40 | MOTOROLA |
获取价格 |
32-BIT, 40MHz, MICROPROCESSOR, PBGA256, BGA-256 | |
XPC821ZP40 | ETC |
获取价格 |
Microprocessor | |
XPC823CVF66B2 | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, MABGA- | |
XPC823CVR66B2T | NXP |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 | |
XPC823CZT25Z3 | NXP |
获取价格 |
MICROPROCESSOR | |
XPC823CZT66B2 | MOTOROLA |
获取价格 |
IC,MICROPROCESSOR,32-BIT,BGA,256PIN,PLASTIC |