是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352 | 针数: | 352 |
Reach Compliance Code: | unknown | 风险等级: | 5.77 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 66 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B352 |
JESD-609代码: | e1 | 长度: | 35 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 352 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | 245 |
认证状态: | COMMERCIAL | 座面最大高度: | 1.65 mm |
速度: | 200 MHz | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 35 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC8240LZU200E | FREESCALE |
获取价格 |
MPC8240 Part Number Specification for the XPC8240RXXnnnx Series | |
XPC8240LZU200E | ROCHESTER |
获取价格 |
32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352 | |
XPC8240RVV250 | FREESCALE |
获取价格 |
Modified voltage specifications to achieve 250 MHz | |
XPC8240RVV250E | FREESCALE |
获取价格 |
Modified voltage specifications to achieve 250 MHz | |
XPC8240RZU250 | FREESCALE |
获取价格 |
Modified voltage specifications to achieve 250 MHz | |
XPC8240RZU250E | FREESCALE |
获取价格 |
Modified voltage specifications to achieve 250 MHz | |
XPC8241LZP166 | ETC |
获取价格 |
Microprocessor | |
XPC8241LZP200 | MOTOROLA |
获取价格 |
Microprocessor | |
XPC8241TXXX | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications | |
XPC8241TZP166B | FREESCALE |
获取价格 |
Intergrated Processor Hardware Specifications |