Datasheet > XPC823ZT25Z3

XPC823ZT25Z3

更新时间： 2024-02-29 06:55:45

品牌	Logo	应用领域
恩智浦 - NXP		外围集成电路
页数	文件大小	规格书
16页	44K
描述
MICROPROCESSOR

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XPC823ZT25Z3 技术参数

生命周期：	Transferred	包装说明：	BGA,
Reach Compliance Code：	unknown	风险等级：	5.72
位大小：	32	边界扫描：	YES
格式：	FIXED POINT	集成缓存：	YES
JESD-30 代码：	S-PBGA-B256	低功率模式：	YES
端子数量：	256	最高工作温度：	70 °C
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	SQUARE
封装形式：	GRID ARRAY	速度：	25 MHz
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子形式：	BALL
端子位置：	BOTTOM	uPs/uCs/外围集成电路类型：	MICROPROCESSOR
Base Number Matches：	1

XPC823ZT25Z3 数据手册

Order this document by

MPC823/D

REV 3

Imaging Systems Division

Consumer Systems Group

MPC823

Product Brief

MPC823

PowerPC Mobile Computing Microprocessor

MPC823 Overview

The MPC823 microprocessor is a versatile, one-chip integrated

microprocessor and peripheral combination that can be used in a variety of

portable electronic products. It is described as a low-cost version of the

MPC821 microprocessor that provides an effective price/performance

along with system enhancements for communication and displays.

Speciﬁcally, it has a universal serial bus (USB) interface and video display

controller, as well as the existing LCD controller of the MPC821 device.

The MPC823 microprocessor particularly excels in low-power, portable,

image capture, and personal communication products. The MPC823

™

microprocessor integrates a high-performance embedded PowerPC core

with a communication processor module that uses a specialized RISC

processor for imaging and communication. The communication processor

module can perform embedded signal processing functions for image

compression and decompression. It also supports six serial channels—one

serial communication controller, two serial management controllers, one

I C® port, one universal serial bus channel, and one serial peripheral

interface. This two-processor architecture consumes power more efﬁciently

than traditional architectures because the communication processor module

frees the core from peripheral tasks like imaging and communication.

FEATURES

The following list summarizes the main features of the MPC823:

• Embedded PowerPC Core Provides 107 MIPS (Using Dhrystone 2.1) or

186K Dhrystones 2.1 at 81 MHz

Continued on next page

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

PowerPC is a registered trademark of IBM Corp. and is used by Motorola under license from IBM Corp. I²C is a registered trademark of Philips

Corporation.

SEMICONDUCTOR PRODUCT INFORMATION

12 3 4 5 6 7...16

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与XPC823ZT25Z3相关器件

型号	品牌	获取价格	描述	数据表
XPC823ZT50Z3	NXP	获取价格	MICROPROCESSOR
XPC823ZT66B2T	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA
XPC823ZT81B2T	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 81MHz, CMOS, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA
XPC823ZT81B2T	NXP	获取价格	32-BIT, 81MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
XPC8240LVV200E	MOTOROLA	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
XPC8240LVV200E	NXP	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
XPC8240LVV200E	ROCHESTER	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, TBGA-352
XPC8240LZU200E	FREESCALE	获取价格	MPC8240 Part Number Specification for the XPC8240RXXnnnx Series
XPC8240LZU200E	ROCHESTER	获取价格	32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.27 MM PITCH, TBGA-352
XPC8240RVV250	FREESCALE	获取价格	Modified voltage specifications to achieve 250 MHz

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