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XCV1000-4BGG560I

更新时间: 2024-02-28 05:08:17
品牌 Logo 应用领域
赛灵思 - XILINX 时钟可编程逻辑
页数 文件大小 规格书
76页 530K
描述
Field Programmable Gate Array, 6144 CLBs, 1124022 Gates, 250MHz, CMOS, PBGA560, BGA-560

XCV1000-4BGG560I 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LBGA,针数:560
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.8最大时钟频率:250 MHz
CLB-Max的组合延迟:0.8 nsJESD-30 代码:S-PBGA-B560
JESD-609代码:e1长度:42.5 mm
湿度敏感等级:3可配置逻辑块数量:6144
等效关口数量:1124022端子数量:560
组织:6144 CLBS, 1124022 GATES封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):260
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:1.7 mm最大供电电压:2.625 V
最小供电电压:2.375 V标称供电电压:2.5 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:42.5 mm
Base Number Matches:1

XCV1000-4BGG560I 数据手册

 浏览型号XCV1000-4BGG560I的Datasheet PDF文件第4页浏览型号XCV1000-4BGG560I的Datasheet PDF文件第5页浏览型号XCV1000-4BGG560I的Datasheet PDF文件第6页浏览型号XCV1000-4BGG560I的Datasheet PDF文件第8页浏览型号XCV1000-4BGG560I的Datasheet PDF文件第9页浏览型号XCV1000-4BGG560I的Datasheet PDF文件第10页 
R
Virtex2.5 V Field Programmable Gate Arrays  
Eight I/O banks result from separating each edge of the  
FPGA into two banks, as shown in Figure 3. Each bank has  
multiple VCCO pins, all of which must be connected to the  
same voltage. This voltage is determined by the output  
standards in use.  
Input Path  
A buffer In the Virtex IOB input path routes the input signal  
either directly to internal logic or through an optional input  
flip-flop.  
An optional delay element at the D-input of this flip-flop elim-  
inates pad-to-pad hold time. The delay is matched to the  
internal clock-distribution delay of the FPGA, and when  
used, assures that the pad-to-pad hold time is zero.  
Bank 0  
Bank 1  
GCLK3 GCLK2  
Each input buffer can be configured to conform to any of the  
low-voltage signalling standards supported. In some of  
these standards the input buffer utilizes a user-supplied  
threshold voltage, VREF. The need to supply VREF imposes  
constraints on which standards can used in close proximity  
to each other. See I/O Banking, page 3.  
Virtex  
Device  
GCLK1 GCLK0  
There are optional pull-up and pull-down resistors at each  
user I/O input for use after configuration. Their value is in  
the range 50 k100 k.  
Bank 5  
Bank 4  
X8778_b  
Output Path  
Figure 3: Virtex I/O Banks  
The output path includes a 3-state output buffer that drives  
the output signal onto the pad. The output signal can be  
routed to the buffer directly from the internal logic or through  
an optional IOB output flip-flop.  
Within a bank, output standards can be mixed only if they  
use the same VCCO. Compatible standards are shown in  
Table 2. GTL and GTL+ appear under all voltages because  
The 3-state control of the output can also be routed directly  
from the internal logic or through a flip-flip that provides syn-  
chronous enable and disable.  
their open-drain outputs do not depend on VCCO  
.
Table 2: Compatible Output Standards  
VCCO Compatible Standards  
Each output driver can be individually programmed for a  
wide range of low-voltage signalling standards. Each output  
buffer can source up to 24 mA and sink up to 48mA. Drive  
strength and slew rate controls minimize bus transients.  
3.3 V PCI, LVTTL, SSTL3 I, SSTL3 II, CTT, AGP, GTL,  
GTL+  
2.5 V SSTL2 I, SSTL2 II, LVCMOS2, GTL, GTL+  
1.5 V HSTL I, HSTL III, HSTL IV, GTL, GTL+  
In most signalling standards, the output High voltage  
depends on an externally supplied VCCO voltage. The need  
to supply VCCO imposes constraints on which standards  
can be used in close proximity to each other. See I/O Bank-  
ing, page 3.  
Some input standards require a user-supplied threshold  
voltage, VREF. In this case, certain user-I/O pins are auto-  
matically configured as inputs for the VREF voltage. Approx-  
imately one in six of the I/O pins in the bank assume this  
role.  
An optional weak-keeper circuit is connected to each out-  
put. When selected, the circuit monitors the voltage on the  
pad and weakly drives the pin High or Low to match the  
input signal. If the pin is connected to a multiple-source sig-  
nal, the weak keeper holds the signal in its last state if all  
drivers are disabled. Maintaining a valid logic level in this  
way eliminates bus chatter.  
The VREF pins within a bank are interconnected internally  
and consequently only one VREF voltage can be used within  
each bank. All VREF pins in the bank, however, must be con-  
nected to the external voltage source for correct operation.  
Because the weak-keeper circuit uses the IOB input buffer  
to monitor the input level, an appropriate VREF voltage must  
be provided if the signalling standard requires one. The pro-  
vision of this voltage must comply with the I/O banking  
rules.  
Within a bank, inputs that require VREF can be mixed with  
those that do not. However, only one VREF voltage can be  
used within a bank. Input buffers that use VREF are not 5 V  
tolerant. LVTTL, LVCMOS2, and PCI 33 MHz 5 V, are 5 V  
tolerant.  
I/O Banking  
The VCCO and VREF pins for each bank appear in the device  
Pinout tables and diagrams. The diagrams also show the  
bank affiliation of each I/O.  
Some of the I/O standards described above require VCCO  
and/or VREF voltages. These voltages externally and con-  
nected to device pins that serve groups of IOBs, called  
banks. Consequently, restrictions exist about which I/O  
standards can be combined within a given bank.  
Within a given package, the number of VREF and VCCO pins  
can vary depending on the size of device. In larger devices,  
DS003-2 (v2.8.1) December 9, 2002  
Product Specification  
www.xilinx.com  
1-800-255-7778  
Module 2 of 4  
3

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