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XC2V3000-6BFG957I PDF预览

XC2V3000-6BFG957I

更新时间: 2024-11-08 19:54:15
品牌 Logo 应用领域
赛灵思 - XILINX 时钟可编程逻辑
页数 文件大小 规格书
318页 2410K
描述
Field Programmable Gate Array, 3584 CLBs, 3000000 Gates, 820MHz, CMOS, PBGA957, 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957

XC2V3000-6BFG957I 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957针数:957
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.81最大时钟频率:820 MHz
CLB-Max的组合延迟:0.35 nsJESD-30 代码:S-PBGA-B957
JESD-609代码:e1长度:40 mm
湿度敏感等级:4可配置逻辑块数量:3584
等效关口数量:3000000端子数量:957
组织:3584 CLBS, 3000000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):245
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:3.5 mm最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:40 mm
Base Number Matches:1

XC2V3000-6BFG957I 数据手册

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Virtex-II Platform FPGAs:  
Complete Data Sheet  
DS031 (v3.5) November 5, 2007  
Product Specification  
Module 1:  
Introduction and Overview  
Module 3:  
DC and Switching Characteristics  
7 pages  
43 pages  
Summary of Features  
General Description  
Architecture  
Device/Package Combinations and Maximum I/O  
Ordering Examples  
Electrical Characteristics  
Performance Characteristics  
Switching Characteristics  
Pin-to-Pin Output Parameter Guidelines  
Pin-to-Pin Input Parameter Guidelines  
DCM Timing Parameters  
Source-Synchronous Switching Characteristics  
Module 2:  
Functional Description  
Module 4:  
Pinout Information  
41 pages  
Detailed Description  
226 pages  
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Input/Output Blocks (IOBs)  
Digitally Controlled Impedance (DCI)  
Configurable Logic Blocks (CLBs)  
18-Kb Block SelectRAM™ Resources  
18-Bit x 18-Bit Multipliers  
Global Clock Multiplexer Buffers  
Digital Clock Manager (DCM)  
Pin Definitions  
Pinout Tables  
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CS144/CSG144 Chip-Scale BGA Package  
FG256/FGG256 Fine-Pitch BGA Package  
FG456/FGG456 Fine-Pitch BGA Package  
FG676/FGG676 Fine-Pitch BGA Package  
BG575/BGG575 Standard BGA Package  
BG728/BGG728 Standard BGA Package  
FF896 Flip-Chip Fine-Pitch BGA Package  
FF1152 Flip-Chip Fine-Pitch BGA Package  
FF1517 Flip-Chip Fine-Pitch BGA Package  
BF957Flip-Chip BGA Package  
Routing  
Creating a Design  
Configuration  
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision  
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.  
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other  
trademarks are the property of their respective owners.  
DS031 (v3.5) November 5, 2007  
www.xilinx.com  
Product Specification  
1

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