是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | 针数: | 1152 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.82 | Is Samacsys: | N |
最大时钟频率: | 820 MHz | CLB-Max的组合延迟: | 0.35 ns |
JESD-30 代码: | S-PBGA-B1152 | JESD-609代码: | e0 |
长度: | 35 mm | 湿度敏感等级: | 4 |
可配置逻辑块数量: | 3584 | 等效关口数量: | 3000000 |
输入次数: | 720 | 逻辑单元数量: | 32256 |
输出次数: | 720 | 端子数量: | 1152 |
组织: | 3584 CLBS, 3000000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA1152,34X34,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 225 | 电源: | 1.5,1.5/3.3,3.3 V |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 3.4 mm | 子类别: | Field Programmable Gate Arrays |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead (Sn63Pb37) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 35 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XC2V3000-6FF1517C | XILINX |
获取价格 |
Field Programmable Gate Array, 3584 CLBs, 3000000 Gates, CMOS, PBGA1517, 1 MM PITCH, FLIP | |
XC2V3000-6FF1517I | XILINX |
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Field Programmable Gate Array, 3584 CLBs, 3000000 Gates, CMOS, PBGA1517, 1 MM PITCH, FLIP | |
XC2V3000-6FG256C | XILINX |
获取价格 |
Virtex-II Platform FPGAs: Complete Data Sheet | |
XC2V3000-6FG256I | XILINX |
获取价格 |
Virtex-II Platform FPGAs: Complete Data Sheet | |
XC2V3000-6FG456C | XILINX |
获取价格 |
Virtex-II Platform FPGAs: Complete Data Sheet | |
XC2V3000-6FG456I | XILINX |
获取价格 |
Virtex-II Platform FPGAs: Complete Data Sheet | |
XC2V3000-6FG676C | XILINX |
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Virtex-II 1.5V Field-Programmable Gate Arrays | |
XC2V3000-6FG676I | XILINX |
获取价格 |
Virtex-II 1.5V Field-Programmable Gate Arrays | |
XC2V40 | XILINX |
获取价格 |
Virtex-II 1.5V Field-Programmable Gate Arrays | |
XC2V40_1 | XILINX |
获取价格 |
Virtex-II Platform FPGAs: Complete Data Sheet |