0
R
Virtex-II 1.5V
Field-Programmable Gate Arrays
0
0
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
®
Summary of Virtex -II Features
•
Industry First Platform FPGA Solution
-
-
-
Digitally Controlled Impedance (DCI) I/O: on-chip
termination resistors for single-ended I/O standards
•
IP-Immersion™ Architecture
PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz
compliance, and CardBus compliant
-
-
-
Densities from 40K to 8M system gates
420 MHz internal clock speed (Advance Data)
840+ Mb/s I/O (Advance Data)
Differential Signaling
·
840 Mb/s Low-Voltage Differential Signaling I/O
(LVDS) with current mode drivers
Bus LVDS I/O
Lightning Data Transport (LDT) I/O with current
driver buffers
•
SelectRAM™ Memory Hierarchy
-
3 Mb of True Dual-Port™ RAM in 18-Kbit block
SelectRAM resources
·
·
-
-
Up to 1.5 Mb of distributed SelectRAM resources
High-performance interfaces to external memory
·
Low-Voltage Positive Emitter-Coupled Logic
(LVPECL) I/O
·
·
·
·
DDR-SDRAM interface
FCRAM interface
QDR™-SRAM interface
Sigma RAM interface
·
Built-in DDR Input and Output registers
-
Proprietary high-performance SelectLink™
Technology
·
·
·
High-bandwidth data path
Double Data Rate (DDR) link
Web-based HDL generation methodology
•
•
Arithmetic Functions
-
-
Dedicated 18-bit x 18-bit multiplier blocks
Fast look-ahead carry logic chains
•
•
Supported by Xilinx Foundation™ and Alliance™
Series Development Systems
Flexible Logic Resources
-
Up to 93,184 internal registers / latches with Clock
-
-
-
Integrated VHDL and Verilog design flows
Compilation of 10M system gates designs
Internet Team Design (ITD) tool
Enable
-
Up to 93,184 look-up tables (LUTs) or cascadable
16-bit shift registers
SRAM-Based In-System Configuration
-
-
Wide multiplexers and wide-input function support
-
-
Fast SelectMAP™ configuration
Horizontal cascade chain and Sum-of-Products
support
Triple Data Encryption Standard (DES) security
option (Bitstream Encryption)
-
Internal 3-state bussing
-
-
-
-
IEEE1532 support
•
High-Performance Clock Management Circuitry
Partial reconfiguration
Unlimited re-programmability
Readback capability
-
Up to 12 DCM (Digital Clock Manager) modules
·
·
·
Precise clock de-skew
Flexible frequency synthesis
High-resolution phase shifting
•
•
0.15 µm 8-Layer Metal process with 0.12 µm
high-speed transistors
-
16 global clock multiplexer buffers
1.5 V (VCCINT) core power supply, dedicated 3.3 V
CCAUX auxiliary and VCCO I/O power supplies
•
•
Active Interconnect™ Technology
V
-
-
Fourth generation segmented routing structure
Predictable, fast routing delay, independent of
fanout
•
•
IEEE 1149.1 compatible boundary-scan logic support
Flip-Chip and Wire-Bond Ball Grid Array (BGA)
packages in three standard fine pitches (0.80mm,
1.00mm, and 1.27mm)
SelectI/O-Ultra™ Technology
-
-
Up to 1,108 user I/Os
19 single-ended standards and six differential
standards
•
100% factory tested
-
Programmable sink current (2 mA to 24 mA) per I/O
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
1