Datasheet > XBP24CZ7WITB003

XBP24CZ7WITB003

更新时间： 2024-01-07 11:22:07

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XBP24CZ7WITB003 数据手册

PCB design and manufacturing

Rework

following information is given as a guideline in such cases to increase the chances of success during

rework, though the warranty is still voided.

The module may be removed from the OEM PCB by the use of a hot air rework station, or hot plate.

Care should be taken not to overheat the module. During rework, the module temperature may rise

above its internal solder melting point and care should be taken not to dislodge internal components

from their intended positions.

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

180

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