XB1002-BD

更新时间： 2024-01-10 11:07:50

品牌	Logo	应用领域
MIMIX		射频和微波射频放大器微波放大器缓冲放大器
页数	文件大小	规格书
6页	412K
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XB1002-BD 数据手册

36.0-43.0 GHz GaAs MMIC

Buffer Amplifier

April 2005 - Rev 01-Apr-05

B1002

1.150

(0.045)

1.750

(0.069)

Mechanical Drawing

1.500

(0.059)

0.750

(0.030)

0.750

(0.030)

0.0

2.900

(0.114)

1.150

(0.045)

1.750

(0.069)

(Note: Engineering designator is 38BSA_01B1)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.691 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg2)

Bond Pad #6 (Vg1)

Bias Arrangement

Vd1,2

Bypass Capacitors - See App Note [2]

RF In

RF Out

XB1002

Out

Vg1,2

Page 3 of 6

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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