XB1004-BD
Buffer Amplifier
16.0-30.0 GHz
Rev. V1
Features
Chip Device Layout
High Dynamic Range
Excellent LO Driver/Buffer Amplifier
Low Noise or Power Bias Configurations
21.0 dB Small Signal Gain
2.2 dB Noise Figure at Low Noise Bias
+19.0 dBm P1dB Compression Point at Power
Bias
100% On-Wafer RF, DC and Noise Figure
Testing
100% Visual Inspection to MIL-STD-883 Method
2010
RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM Tech’s three stage 16.0-30.0 GHz GaAs
MMIC buffer amplifier has a small signal gain of 21.0
dB with a noise figure of 2.2 dB across the band.
This MMIC uses M/A-COM Tech’s GaAs PHEMT
device model technology, and is based upon
electron beam lithography to ensure high
repeatability and uniformity. The chip has surface
passivation to protect and provide a rugged part with
backside via holes and gold metallization to allow
either a conductive epoxy or eutectic solder die
attach process. This device is well suited for
Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
Parameter
Absolute Max.
Supply Voltage (Vd)
Supply Current (Id)
+6.5 VDC
200 mA
Gate Bias Voltage (Vg)
Input Power (Pin)
+0.3 V
+5 dBm
Storage Temperature (Tstg)
-65 °C to +165 °C
-55 °C to MTTF
Operating Temperature (Ta)
Channel Temperature (Tch)
Table1
MTTF Table1
1. Channel temperature directly affects a device's MTTF. Chan-
nel temperature should be kept as low as possible to maximize
lifetime.
Ordering Information
Part Number
Package
“V” - vacuum release
XB1004-BD-000V
gel paks
XB1004-BD-000W
XB1004-BD-EV1
“W” - waffle trays
evaluation module
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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