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XAM3517BZER

更新时间： 2024-02-04 16:35:38
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德州仪器 - TI 微处理器
页数 文件大小 规格书
218页 1608K
描述
AM3517/05 ARM Microprocessor

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XAM3517BZER 技术参数

是否Rohs认证：符合生命周期：Obsolete
零件包装代码：BGA包装说明：PLASTIC, NFBGA-491
针数：491Reach Compliance Code：compliant
ECCN代码：3A991.A.2HTS代码：8542.31.00.01
风险等级：5.78Is Samacsys：N
地址总线宽度：16位大小：32
边界扫描：YES最大时钟频率：26 MHz
外部数据总线宽度：16格式：FLOATING POINT
集成缓存：YESJESD-30 代码：S-PBGA-B491
长度：17 mm低功率模式：YES
端子数量：491封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA491,25X25,25
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED电源：1.2,1.8,1.8/3.3,3.3 V
认证状态：Not Qualified座面最大高度：1.3 mm
速度：600 MHz子类别：Microprocessors
最大供电电压：1.248 V最小供电电压：1.152 V
标称供电电压：1.2 V表面贴装：YES
技术：CMOS端子形式：BALL
端子节距：0.65 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：17 mm
uPs/uCs/外围集成电路类型：MICROPROCESSORBase Number Matches：1

XAM3517BZER 数据手册

 浏览型号XAM3517BZER的Datasheet PDF文件第2页浏览型号XAM3517BZER的Datasheet PDF文件第3页浏览型号XAM3517BZER的Datasheet PDF文件第4页浏览型号XAM3517BZER的Datasheet PDF文件第5页浏览型号XAM3517BZER的Datasheet PDF文件第6页浏览型号XAM3517BZER的Datasheet PDF文件第7页 
AM3517, AM3505  
www.ti.com  
SPRS550A–OCTOBER 2009–REVISED MAY 2010  
AM3517/05 ARM Microprocessor  
Check for Samples: AM3517, AM3505  
1 AM3517/05 ARM Microprocessor  
1.1 Features  
123  
–
SIDETONE Core Support (McBSP2 and  
3 Only) For Filter, Gain, and Mix  
Operations  
128-Channel Transmit/Receive Mode  
Direct Interface to I2S and PCM Device  
and TDM Buses  
• AM3517/05 ARM Microprocessor:  
– Software Compatible with OMAPTM  
Processors  
3
–
–
– MPU Subsystem  
•
•
600-MHz ARM Cortex-A8 Core  
NEON SIMD Coprocessor and Vector  
floating point (FP) co-processor  
•
•
HDQ/1-Wire Interface  
4 UARTs (One with Infrared Data  
Association [IrDA] and Consumer Infrared  
[CIR] Modes)  
3 Master/Slave High-Speed  
Inter-Integrated Circuit (I2C) Controllers  
12 32-bit General Purpose Timers  
1 32-bit Watchdog Timer  
1 32-bit 32-kHz Sync Timer  
Up to 186 General-Purpose I/O (GPIO)  
Pins  
– Memory Interfaces:  
•
16/32- bit mDDR/DDR2 Interface with 1  
GByte total addressable space  
•
•
General Purpose Memory Interface  
supporting 16-bit Wide Multiplexed  
Address/Data bus  
•
•
•
•
•
•
64 K-Byte SRAM  
3 Removable Media Interfaces  
[MMC/SD/SDIO]  
– IO Voltage:  
• Display subsystem  
•
•
mDDR/DDR2 IOs: 1.8V  
Other IOs: 1.8V and 3.3V  
– Parallel Digital Output  
– Up to 24-Bit RGB  
– Supports Up to 2 LCD Panels  
– Support for Remote Frame Buffer Interface  
(RFBI) LCD Panels  
– Core Voltage: 1.2V  
– Commercial and Industrial Temperature  
Grade  
(operating restrictions apply)  
– Two 10-bit Digital-to-Analog Converters  
(DACs) Supporting  
– 16-bit Video Input Port capable of capturing  
HD video  
•
•
Composite NTSC/PAL Video  
Luma/Chroma Separate Video (S-Video)  
– HD resolution Display Subsystem  
– Serial Communication  
– Rotation 90, 180, and 270 degrees  
– Resize Images From 1/4x to 8x  
– Color Space Converter  
•
•
•
High-End CAN Controller  
10/100 Mbit Ethernet MAC  
USB OTG subsystem with standard  
DP/DM interface [HS/FS/LS]  
– 8-bit Alpha Blending  
•
Multiport USB Host Subsystem  
[HS/FS/LS]  
• Video Processing Front End (VPFE) 16-bit  
Video Input Port  
–
12-pin ULPI or 6/4/3-pin Serial  
Interface  
– RAW Data Interface  
– 75-MHz Maximum Pixel Clock  
– Supports REC656/CCIR656 Standard  
– Supports YCbCr422 Format (8-bit or 16-bit  
With Discrete Horizontal and Vertical Sync  
Signals)  
– Generates Optical Black Clamping Signals  
– Built-in Digital Clamping and Black Level  
•
•
Four Master/Slave Multichannel Serial  
Port Interface (McSPI) Ports  
Five Multichannel Buffered Serial Ports  
–
512-Byte Transmit/Receive Buffer  
(McBSP1/3/4/5)  
5K-Byte Transmit/Receive Buffer  
(McBSP2)  
–
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
POWERVR SGX is a trademark of Imagination Technologies Ltd.  
All other trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the formative  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
Copyright © 2009–2010, Texas Instruments Incorporated  
 
 
 
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