WTM604C400LS-HAF
Complementary N/P-Channel Enhancement Mode MOSFET
Features
• Surface-mounted package
• Low Gate-Source Threshold Voltage
• Halogen and Antimony Free(HAF),
RoHS compliant
Q1:1.Source 2.Gate 7.Drain 8.Drain
Q2:3.Source 4.Gate 5.Drain 6.Drain
DFN5060 Plastic Package
Key Parameters(Q1)
Parameter
Key Parameters(Q2)
Value
40
Unit
V
Parameter
-BVDSS
Value
40
Unit
V
BVDSS
20 @ VGS = 10 V
24 @ VGS = 4.5 V
1.7
44 @ -VGS = 10 V
59 @ -VGS = 4.5 V
1.6
RDS(ON) Max
mΩ
RDS(ON) Max
mΩ
VGS(th) typ
Qg typ
V
-VGS(th) typ
Qg typ
V
22 @ VGS = 10 V
nC
19 @ -VGS = 10 V
nC
Absolute Maximum Ratings (at Ta = 25℃ unless otherwise specified)
Value
Symbol
Unit
Parameter
Q1
Q2
- 40
± 20
VDS
VGS
40
V
V
Drain-Source Voltage
± 20
Gate-Source Voltage
Tc = 25℃
26
16
- 15
- 9.4
ID
A
Continuous Drain Current
Tc = 100℃
Peak Drain Current, Pulsed 1)
Avalanche Current
IDM
IAS
100
9.8
24
- 60
A
A
-16.8
14.1
Single Pulse Avalanche Energy 2)
EAS
mJ
W
℃
PD
15.6
Power Dissipation
Tc = 25℃
TJ, Tstg
- 55 to + 150
Operating Junction and Storage Temperature Range
Thermal Characteristics(Q1\Q2)
Parameter
Symbol
Max.
8
Unit
Thermal Resistance from Junction to Case
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Q1: Limited by TJ(MAX), starting TJ = 25 °C, L = 0.5 mH, Rg = 25 Ω, IAS = 9.8 A, VGS = 10 V.
RθJC
℃
℃
/W
/W
RθJA
67
Q2: Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, -IAS = 16.8 A, VGS = 10 V.
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 19/04/2023 Rev: 02