Datasheet > WS512K32NV-20G2UCA

WS512K32NV-20G2UCA

更新时间： 2024-01-30 21:10:29

品牌	Logo	应用领域
WEDC		静态存储器内存集成电路
页数	文件大小	规格书
7页	345K
描述
SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 22.4 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

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WS512K32NV-20G2UCA 数据手册

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WS512K32V-XXX

White Electronic Designs

512Kx32 SRAM 3.3V MULTICHIP PACKAGE

FEATURES

Access Times of 15, 17, 20ns

Low Voltage Operation

Packaging

Low Power CMOS

TTL Compatible Inputs and Outputs

Fully Static Operation:

• 66-pin, PGA Type, 1.075 inch square, Hermetic

Ceramic HIP (Package 400)

• No clock or refresh required.

Three State Output.

• 68 lead, 22.4mm (0.880 inch) CQFP, (G2U),

3.56mm (0.140"), (Package 510)

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Organized as 512Kx32; User Conﬁgurable as

2x512Kx16 or 4x512Kx8

Weight

WS512K32V-XG2UX - 8 grams typical

WS512K32NV-XH1X - 13 grams typical

Commercial, Industrial and Military Temperature

Ranges

Low Voltage Operation:

* This product is subject to change without notice.

• 3.3V ± 10% Power Supply

PIN CONFIGURATION FOR WS512K32NV-XH1X

Top View Pin Description

I/O_0-31

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

A_0-18

I/O8

I/O9

I/O10

A13

WE2#

CS²#

GND

I/O¹¹

A10

I/O15

I/O24

I/O25

I/O26

VCC

CS4#

WE⁴#

I/O²⁷

I/O31

I/O30

I/O29

I/O28

WE_1-4

I/O14

I/O13

I/O12

OE#

A¹⁸

CS_1-4

OE#

V_CC

Output Enable

Power Supply

Ground

GND

Not Connected

A14

A15

A11

Block Diagram

A16

A12

WE1#

I/O⁷

A⁸

WE₁# CS₁#

WE₂# CS₂#

WE₃# CS₃#

WE₄# CS₄#

OE#

A_0-18

A17

VCC

WE3#

CS³#

GND

I/O¹⁹

I/O23

I/O22

I/O21

I/O20

CS1#

I/O6

I/O16

I/O17

I/O18

512K x 8

I/O0

I/O1

I/O2

I/O5

I/O³

I/O4

I/O_0-7

I/O_8-15

I/O_16-23

I/O_24-31

M a r c h 2 0 0 6

Rev. 12

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7

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