Datasheet > WS512K32NV-20H1M

WS512K32NV-20H1M

更新时间： 2024-10-31 22:41:27

品牌	Logo	应用领域
其他 - ETC		内存集成电路静态存储器
页数	文件大小	规格书
8页	131K
描述
512Kx32 SRAM 3.3V MODULE

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

WS512K32NV-20H1M 数据手册

WS512K32V-XXX

HI-RELIABILITY PRODUCT

512Kx32 SRAM 3.3V MODULE PRELIMINARY*

FEATURES

■ Access Times of 15, 17, 20ns

■ Low Voltage Operation

■ Packaging

■ Low Power CMOS

■ TTL Compatible Inputs and Outputs

■ Fully Static Operation:

• 66-pin, PGA Type, 1.075 inch square, Hermetic

Ceramic HIP (Package 400)

• No clock or refresh required.

■ Three State Output.

• 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high,

(Package 509)

■ Built-in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

■ Weight

• 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U),

3.56mm (0.140") high, (Package 519)

■ Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8

■ Commercial, Industrial and Military Temperature Ranges

■ Low Voltage Operation:

WS512K32V-XG2TX - 8 grams typical

WS512K32V-XG1UX - 5 grams typical

WS512K32NV-XH1X - 13 grams typical

This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

• 3.3V ± 10% Power Supply

PIN CONFIGURATION FOR WS512K32NV-XH1X

TOP VIEW

PIN DESCRIPTION

I/O0-31 Data Inputs/Outputs

A0-18

WE1-4

CS1-4

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

I/O

I/O15

I/O14

I/O13

I/O12

I/O24

I/O25

I/O26

I/O31

I/O30

I/O29

I/O28

CS2

I/O10

GND

I/O11

VCC

I/O27

GND

A10

A11

A12

VCC

Not Connected

A18

BLOCK DIAGRAM

WE1

WE₁CS₁

WE₂CS₂

WE₃CS₃

WE₄CS₄

I/O

I/O23

I/O22

I/O21

I/O20

0-18

I/O

I/O16

I/O17

I/O18

512K x 8

GND

I/O19

I/O16-23

I/O24-31

I/O0-7

I/O8-15

May 2001 Rev. 6

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7 8

中文翻译

下载PDF

与WS512K32NV-20H1M相关器件

型号	品牌	获取价格	描述	数据表
WS512K32NV-20H1MA	ETC	获取价格	512Kx32 SRAM 3.3V MODULE
WS512K32NV-70G2TCA	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CQFP68, QFP-68
WS512K32NV-70G2TI	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CQFP68, HERMETIC SEALED, CERAMIC, QFP-68
WS512K32NV-70G2TIA	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CQFP68, QFP-68
WS512K32NV-70G2TMA	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CQFP68, QFP-68
WS512K32NV-70G2TQ	WEDC	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CQMA68, HERMETIC SEALED, CERAMIC, QFP-68
WS512K32NV-70HC	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CHIP66, CERAMIC, HIP-66
WS512K32NV-70HI	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CHIP66, CERAMIC, HIP-66
WS512K32NV-70HM	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CHIP66, CERAMIC, HIP-66
WS512K32NV-70HMA	MICROSEMI	获取价格	SRAM Module, 512KX32, 70ns, CMOS, CPGA66, 1.185 X 1.185 INCH, CERAMIC, HIP-66

与WS512K32NV-20H1M相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

22
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

23
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

46
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

54

产品中心

服务支持

精选活动

关于我们

帮助中心

WS512K32NV-20H1M

WS512K32NV-20H1M 数据手册

与WS512K32NV-20H1M相关器件

与WS512K32NV-20H1M相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

WS512K32NV-20H1M

WS512K32NV-20H1M 数据手册

与WS512K32NV-20H1M相关器件

与WS512K32NV-20H1M相关文章

您还可以找

您在本页遇到什么问题？