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WS512K32NBV-15G2IEA PDF预览

WS512K32NBV-15G2IEA

更新时间: 2024-02-20 23:53:55
品牌 Logo 应用领域
WEDC 存储内存集成电路静态存储器信息通信管理
页数 文件大小 规格书
8页 332K
描述
512Kx32 3.3V SRAM MODULE

WS512K32NBV-15G2IEA 技术参数

是否Rohs认证:不符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.61
Is Samacsys:N最长访问时间:15 ns
其他特性:CONFIGURABLE AS 1M X 16 OR 512K X 32JESD-30 代码:S-CQMA-G68
内存密度:16777216 bit内存集成电路类型:SRAM MODULE
内存宽度:8功能数量:1
端子数量:68字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:2MX8封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:SQUARE封装形式:MICROELECTRONIC ASSEMBLY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:MILITARY端子形式:GULL WING
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

WS512K32NBV-15G2IEA 数据手册

 浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第2页浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第3页浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第4页浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第5页浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第6页浏览型号WS512K32NBV-15G2IEA的Datasheet PDF文件第7页 
WS512K32BV-XXXE  
White Electronic Designs  
*ADVANCED  
512Kx32 3.3V SRAM MODULE  
FEATURES  
3.3V Power Supply  
Access Times of 15*, 17, 20ns  
Low Voltage Operation  
Packaging  
BiCMOS  
TTL Compatible Inputs and Outputs  
Built-in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
• 66-pin, PGA Type, 1.385 inch square Hermetic  
Ceramic HIP (Package 402)  
Weight  
• 68 lead, Hermetic CQFP (G2), 22mm (0.880  
inch) square (Package 500). Designed to fit  
JEDEC 68 lead 0.990" CQFJ footprint  
• WS512K32BV-XG2XE - 8 grams typical  
• WS512K32NBV-XH2XE - 13 grams typical  
Organized as 512Kx32; User Configurable as  
1Mx16 or 2Mx8  
* This product is under development, is not qualified or characterized and is subject to  
change or cancellation without notice.  
Radiation Tolerant with Epitaxial Layer Die  
Commercial and Industrial Temperature Ranges  
PIN CONFIGURATION FOR WS512K32NBV-XH2XE  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31 Data Inputs/Outputs  
1
12  
23  
34  
45  
56  
A0-18  
Address Inputs  
I/O  
8
9
WE#  
2
I/O15  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
WE#1-4 Write Enables  
CS#1-4 Chip Selects  
OE#  
VCC  
GND  
NC  
I/O  
CS#  
2
I/O14  
I/O13  
I/O12  
OE#  
CS#  
4
4
Output Enable  
Power Supply  
Ground  
I/O10  
GND  
I/O11  
WE#  
A13  
A14  
A15  
A16  
A17  
A
6
7
I/O27  
Not Connected  
A
A
A
V
10  
A
A
A
3
4
5
3
3
A0  
A1  
A2  
11  
A18  
NC  
BLOCK DIAGRAM  
12  
CC  
WE#  
1
A
8
9
A
I/O7  
I/O6  
I/O5  
I/O4  
A
WE#  
CS#  
I/O23  
I/O22  
I/O21  
I/O20  
WE#1 CS#1  
WE#2 CS#2  
WE#3 CS#3  
WE#4 CS#4  
512K x 8  
OE#  
A0-18  
I/O0  
I/O1  
I/O2  
CS#  
NC  
1
I/O16  
I/O17  
I/O18  
GND  
I/O19  
512K x 8  
512K x 8  
512K x 8  
I/O3  
8
8
8
8
11  
22  
33  
44  
55  
66  
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
White Electronic Designs Corp. reserves the right to change products or specifications without notice.  
December, 1999  
Rev. 2  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  

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