Datasheet > WS128K32NV-15H1IA

WS128K32NV-15H1IA

更新时间： 2024-09-15 22:13:31

品牌	Logo	应用领域
其他 - ETC		静态存储器
页数	文件大小	规格书
8页	102K
描述
128Kx32 3.3V SRAM MULTICHIP PACKAGE

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

WS128K32NV-15H1IA 数据手册

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第2页

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第3页

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第4页

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第5页

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第6页

浏览型号WS128K32NV-15H1IA的Datasheet PDF文件第7页

WS128K32V-XXX

128Kx32 3.3V SRAM MULTICHIP PACKAGE PRELIMINARY*

FEATURES

■ 3.3 Volt Power Supply

■ Low Power CMOS

■ Access Times of 15**, 17, 20, 25, 35ns

■ Low Voltage Operation

■ Packaging

■ TTL Compatible Inputs and Outputs

• 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic

HIP (Package 400)

■ Built-in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square

(Package 509), 4.57mm (0.180 inch) high. Designed to fit

JEDEC 68 lead 0.990" CQFJ footprint (Fig. 2)

■ Weight

WS128K32V-XG2TX - 8 grams typical

WS128K32V-XG1UX - 5 grams typical

WS128K32V-XH1X - 13 grams typical

• 68 lead, Hermetic CQFP (G1U), 23.8mm (0.940 inch)

square (Package 509), 3.56mm (0.140 inch) high.

■ Organized as 128Kx32; User Configurable as 256Kx16 or

This data sheet describes a product that is not fully qualified or

characterized and is subject ot change without notice.

512Kx8

■ Commercial, Industrial and Military Temperature Ranges

** Commercial and Industrial temperature ranges only.

FIG. 1 PIN CONFIGURATION FOR WS128K32NV-XH1X

TOP VIEW

PIN DESCRIPTION

I/O0-31

A0-16

WE1-4

CS1-4

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

I/O8

I/O9

I/O10

A13

WE2

CS2

GND

I/O¹¹

A10

I/O15

I/O14

I/O13

I/O12

I/O24

I/O25

I/O26

VCC

CS4

WE4

I/O27

I/O31

I/O30

I/O29

I/O28

Output Enable

Power Supply

Ground

VCC

GND

A14

Not Connected

A15

A11

BLOCK DIAGRAM

A16

A12

WE¹

I/O7

I/O6

I/O5

I/O4

A⁸

WE₁CS₁

WE₂CS₂

WE₃CS₃

WE₄CS₄

VCC

CS1

WE3

CS3

GND

I/O¹⁹

I/O23

I/O22

I/O21

I/O20

0-16

I/O⁰

I/O1

I/O2

I/O16

I/O17

I/O18

128K x 8

I/O³

I/O16-23

I/O24-31

I/O0-7

I/O8-15

April 2001 Rev. 2

White Microelectronics • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7 8

中文翻译

下载PDF

与WS128K32NV-15H1IA相关器件

型号	品牌	获取价格	描述	数据表
WS128K32NV-15H1M	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-15H1MA	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UC	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UCA	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UI	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UIA	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UM	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G1UMA	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G2TC	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17G2TCA	ETC	获取价格	128Kx32 3.3V SRAM MULTICHIP PACKAGE